Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T23:48:52.530Z Has data issue: false hasContentIssue false

Retentivity of RRAM Devices Based on Metal / YBCO Interfaces

Published online by Cambridge University Press:  29 June 2011

A. Schulman
Affiliation:
Departamento de Física – FCEyN – Universidad de Buenos Aires, Pabellón I, Ciudad Universitaria, C1428EHA Buenos Aires, Argentina
C. Acha
Affiliation:
Departamento de Física – FCEyN – Universidad de Buenos Aires, Pabellón I, Ciudad Universitaria, C1428EHA Buenos Aires, Argentina IFIBA – CONICET
Get access

Abstract

The retention time of the resistive state is a key parameter that characterizes the possible utilization of the RRAM devices as a non – volatile memory device. The understanding of the mechanism of the time relaxation process of the information state may be essential to improve their performances. In this study we examine RRAM devices based on metal / YBCO interfaces in order to comprehend the physics beneath the resistive switching phenomenon.

Our experimental results show that after producing the switching of the resistance from a low to a high state, or vice versa, the resistance evolves to its previous state in a small but noticeable percentage. We have measured long relaxation effects on the resistance state of devices composed by metal (Au, Pt) / ceramic YBCO interfaces in the temperature range 77 K – 300 K. This time relaxation can be described by a stretched exponential law that is characterized by a power exponent n = 0.5, which is temperature independent, and by a relaxation time τ that increases with increasing the temperature. These characteristics point out to a non-thermally assisted diffusion process that could be associated with oxygen (or vacancy) migration and that produces the growth of a conducting (or insulating) fractal structure.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Burr, G. W., Kurdi, B. N., Scott, J. C., Lam, C. H., Gopalakrishnan, K., and Shenoy, R. S., IBM J. Res. & Dev. 52, 449 (2008).Google Scholar
2. Waser, R. and Aono, M., Nature Materials 6, 833 (2007).Google Scholar
3. Sawa, A., Materials Today 11, 28 (2008).Google Scholar
4. Porcar, L., Bourgault, D., Tournier, R., Barbut, J. M., Barrault, M., and Germi, P., Physica C 275, 1997 (1997).Google Scholar
5. Acha, C. and Rozenberg, M. J., J. Phys.: Condens. Matter 21, 045702 (2009).Google Scholar
6. Acha, C., Physica B 404, 2746 (2009).Google Scholar
7. Nian, Y. B., Strozier, J., Wu, N.J., Chen, X., and Ignatiev, A., Phys. Rev. Lett. 98, 146403 (2007).Google Scholar
8. Avrami, M., J. Chem. Phys. 8, 212 (1940).Google Scholar
10. Li, T., Zhang, X.H., Zhu, Y.G., Huang, X., Han, L.F., Shang, X.J., Ni, H.Q., and Niu, Z.C., Physica E 42, 1597 (2010).Google Scholar