Hostname: page-component-8448b6f56d-c47g7 Total loading time: 0 Render date: 2024-04-22T23:08:49.100Z Has data issue: false hasContentIssue false

Residual Stress Control by Ion Beam Assisted Deposition

Published online by Cambridge University Press:  21 February 2011

G. S. Was
Affiliation:
Nuclear Engineering and Radiological Sciences and, Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
J. W. Jones
Affiliation:
Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
L. Parfitt
Affiliation:
Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
C.E. Kalnas
Affiliation:
Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
M. Goldiner
Affiliation:
Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109
Get access

Abstract

The origin of residual stresses were studied in both crystalline metallic films and amorphous oxide films made by ion beam assisted deposition (IBAD). Monolithic films of AI2O3 were deposited during bombardment by Ne, Ar or Kr over a narrow range of energies, E, and a wide range of ion-to-atom arrival rate ratios, R and were characterized in terms of composition, thickness, density, crystallinity, microstructure and residual stress. The stress was a strong function of ion beam parameters and gas content and compares to the behavior of other amorphous compounds such as MoSix and WS12.2 With increasing normalized energy (eV/atom), residual stress in crystalline metallic films (Mo, W) increases in the tensile direction before reversing and becoming compressive at high normalized energy. The origin of the stress is most likely due to densification or interstitial generation. Residual stress in amorphous films (Al2O3, MoSix and WSi2.2) is initially tensile and monotonically decreases into the compressive region with increasing normalized energy. The amorphous films also incorporate substantially more gas than crystalline films and in the case of Al2O3 are characterized by a high density of voids. Stress due to gas pressure in existing voids explains neither the functional dependence on gas content nor the magnitude of the observed stress. A more likely explanation for the behavior of stress is gas incorporation into the matrix, where the amount of incorporated gas is controlled by trapping.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Evans, A. G. and Hutchinson, J. W., Acta metall. mater. 43 p. 2,507 (1995).Google Scholar
2 Doerner, M. F. and Nix, W. D., Critical Reviews in Solid State and Materials Sciences 14 (3), p. 225 (1988).Google Scholar
3 Hirsch, E. H. and Varga, I. K., Thin Solid Films 69, p. 99 (1980).Google Scholar
4 Seitz, F. and Koehler, J. S., Solid State Phys. 69, p. 305 (1956).Google Scholar
5 Hoffman, D. W. and Thornton, J. A., Thin Solid Films 40, p. 355 (1977).Google Scholar
6 Windischmann, H., Critical Reviews in Solid State and Materials Science 17 (6), p. 547 (1992).Google Scholar
7 Windischmann, H., J. Appi. Phys. 62(5), p. 1800 (1987).Google Scholar
8 Sigmund, P., Topics in Applied Physics: Sputtering by Ion Bombardment 47, edited by Behrisch, R., (Springer-Verlag, Berlin, 1981).Google Scholar
9 Thornton, J. A., Tabock, J. and Hoffman, D. W., Thin Solid Films 64, p. 111 (1979).Google Scholar
10 Dietz, V., Ehrhart, P., Guggi, D., Haubold, H.-G., Jàger, W., Prieler, M. and Schilling, W., Nucl. Instr. Meth. in Phys. Res. B59/60, p. 284 (1991).Google Scholar
11 Fang, C. C., Jones, F. and Prasad, V., J. Appi. Phys. 74(7), p. 4472 (1993).Google Scholar
12 Hoffman, D. W. and Gaerttner, M. R., J. Vac. Sci. Technol. 17(1), p. 425 (1980).Google Scholar
13 Mashayekhi, A., Parfitt, L., Kalnas, C., Jones, J. W., Was, G. S. and Hoffman, D. W., in Materials Modification by Energetic Atoms and Ions, edited by Grabowski, K. S., Barnett, S. A., Rossnagel, S. M. and Wasa, K. (Mater. Res. Soc. Proc. 268, Pittsburgh, PA, 1992), p. 203.Google Scholar
14 Yee, D. S., Floro, J., Mikalsen, D. J., Cuomo, J. J., Ahn, K. Y. and Smith, D. A., J. Vac. Sci. Technol, A3(6), p. 2121 (1985).Google Scholar
15 Roy, R. A., Petkie, R. and Boulding, A., J. Mater. Res. 6 p. 80 (1991).Google Scholar
16 Thornton, J. A., J. Vac. Sci. Technol. 11, p. 666 (1974).Google Scholar
17 Thornton, J. A., Tabock, J. and Hoffman, D. W., Thin Solid Films 64, p. 111 (1979).Google Scholar
18 Parfitt, L., Goldiner, M., Jones, J. W. and Was, G. S., J. Appl. Phys. 77(7) p. 3,029 (1995).Google Scholar
19 Guinier, A. and Foumet, G., Small-Angle Scattering of X-Rays (John Wiley and Sons, New York, 1956).Google Scholar
20 D'Heurle, F. M. and Harper, J. M. E., Thin Solid Films 171, p. 81 (1989).Google Scholar
21 Cuomo, J. J., Harper, J. M. E., Guamieri, C. R., Yee, D. S., Attanasio, L. J., Angilello, J. and Wu, C. T., J. Vac. Sci. Technol. 20(3) p. 349 (1982).Google Scholar
22 Müllier, K.-H., J. Appl. Phys. 62(5) p. 1,796 (1987).Google Scholar
23 Kazansky, P. R., Hultman, L., Ivanov, I. and Sundgren, J.-E., J. Vac. Sci. Technol. A11(4), p. 1426 (1993).Google Scholar
24 Ronchi, C., J. Nucl. Mater. 96, p. 314 (1981).Google Scholar