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Published online by Cambridge University Press: 10 February 2011
In this paper we present a class of MOCVD reactors with loading capacities up to seven 2″ wafers, designed for the mass production of LED structures.
Our processes yield device quality GaN with excellent PL uniformities better than 1 nm across a 2″ wafer and thickness uniformities typically better than 2%.
We also present full 2″ wafer mapping data, High Resolution Photoluminescence Wafer Scanning and sheet resistivity mapping, revealing the excellent composition uniformity of the nitride compounds InGaN and AlGaN. As well we will show sheet resistivity uniformity for Si-doped GaN and Mg-doped GaN.