In this study silicon wafers were bonded using Al/Ni reactive multilayer foils as local heat sources for melting solder layers. Exothermic reactions in Al/Ni reactive multilayer foils were investigated by XRD and DSC. XRD measurements showed that dominant product after exothermic reaction was ordered B2 AlNi compound. The heat of reaction was calculated to be -57.9 KJ/mol by DSC. With Al/Ni reactive multilayer foil, localized heating can be achieved during bonding process. Both experimental measurements and numerical simulation showed that the heat exposure to the wafers was highly limited and localized. Moreover, leakage test showed that this bonding approach possessed a good hermeticity.