Skip to main content Accessibility help
×
Home

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

  • Jonathan C. Doan (a1), John C. Bravman (a1), Paul A. Flinn (a1) and Thomas N. Marieb (a2)

Abstract

Accelerated electromigration tests were performed in a High Voltage SEM (HVSEM). These experiments were conducted on 10 identical, passivated Al interconnect test structures at a temperature of 237°C and a current density of 30mA/µm2. Simultaneous testing and observation of the entire structure allowed the void nucleation times to be measured. Two normal distributions fit the nucleation times. The second of these distributions coincides roughly with the distribution of failure times of the test structures. Fracture of the passivation is hypothesized as the mechanism that causes the concurrent late nucleation and failure processes.

Copyright

References

Hide All
1. Blech, I. A. and Meieran, E. S., Reliability and Maintainability Symposium, 243248 (1970).
2. Levine, E. and Kichter, J., Proceedings of the 22nd annual IEEE International Reliability Physics Symposium, 242249 (1984).
3. Besser, P. R., Madden, M. C., and Flinn, P. A., J. Appl. Phys. 72 (8), 3792–7 (1992).10.1063/1.352276
4. Marieb, T., Flinn, P., Bravman, J. C., Gardner, D., and Madden, M., J. Appl. Phys. 78 (2), 1026–32 (1995).
5. Shatzkes, M. and Lloyd, J. R., J. Appl. Phys. 59 (11), 38903893 (1986).
6. Nix, W. D. and Arzt, E., Metall. Trans. A 23A (7), 2007–13 (1992).
7. Korhonen, M. A. and Borgesen, P., J. Appl. Phys. 73 (8), 37903799 (1993).10.1063/1.354073
8. Kraft, O. and Arzt, E., Appl. Phys. Lett. 66 (16), 2063–5 (1995).10.1063/1.113903
9. Gleixner, R. J., Clemens, B. M., and Nix, W. D., J. Mater. Res. 12 (8), 20812090 (1997).10.1557/JMR.1997.0279
10. Lee, S., Doan, J., Bravman, J. C., Flinn, P. A., Marieb, T. N., and Ogawa, S., in Stress Induced Phenomena in Metallization(American Institue of Physics, Tokyo, Japan, 1997), Vol. 418, pp. 101106.
11. Follstaedt, D. M., Van Den Avyle, J. A., Romig, A. D. Jr., and Knapp, J. A., MRS Symp. Proc. 225, 225–30 (1991).10.1557/PROC-225-225
12. Madden, M. C., Abratowski, E. V., Marieb, T., and Flinn, P.A., MRS Symp. Proc. 265, 33–8 (1992).10.1557/PROC-265-33
13. Flinn, P. A., Lee, S., Doan, J., Marieb, T. N., Bravman, J. C., and Madden, M., in Stress Induced Phenomena in Metallization(American Institue of Physics, Tokyo, Japan, 1997), Vol. 418, pp. 250261.
14. Shapiro, S. S. and Wilk, M. B., Biometrika 52 (3), 591611 (1965).10.1093/biomet/52.3-4.591
15. Blech, I. A., J. Appl. Phys. 47 (4), 12031209 (1976).10.1063/1.322842
16. Lloyd, J. R. and Smith, P. M., J. Vac. Sci. Tech. A 1 (2, pt.1), 455–8 (1983).10.1116/1.571946
17. Lloyd, J. R., Smith, P. M., and Prokop, G. S., Thin Solid Films 93 (3-4), 385–95 (1982).10.1016/0040-6090(82)90144-4
18. Graas, C. D. and Ting, L. L., MRS Symp. Proc. 338, 429–34 (1994).10.1557/PROC-338-429

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

  • Jonathan C. Doan (a1), John C. Bravman (a1), Paul A. Flinn (a1) and Thomas N. Marieb (a2)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed