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Pulsed Plasma Enhanced Chemical Vapor Deposition from CH2F2, C2H2F4, and CHCIF2

  • Catherine B. Labelle (a1), Kenneth K. S. Lau (a1) and Karen K. Gleason (a1)

Abstract

Pulsed plasma enhanced chemical vapor deposition films have been grown from C2H2F4, CH2F2, and CHCLF2. C-Is x-ray photoelectron spectroscopy (XPS) indicates a prevalence of C-CF species in the films from C2H2F4 and CH2F2, whereas CF2 species dominate the films from CHC1F2. The CFx species distributions for the films are largely controlled by the competition between CF2-producing and HF elimination reactions in the pulsed plasmas. Dominance by HF elimination produces films with high C-CF and CF concentrations (e.g., CH2F2), whereas dominance by CF2-producing reactions leads to films with higher CF2 concentrations (e.g., CHCIF2). The % CF3 in the film is lowest for the precursor having the lowest F:H ratio, CH2F2. Little or no hydrogen was detected in the deposited films. Thermal degradation of films from C2H2F4 and CH2F2, as probed by solid-state nuclear magnetic resonance (NMR) spectroscopy, shows a loss through CF3 detachment and HF elimination. Pulsed plasma films from all three precursors gave dielectric constants of 2.4, with loss tangents on the order of 10−2. Dielectric measurements of pulsed plasma films from hexafluoropropylene oxide (HFPO) gave a dielectric constant of 2.0 ± 0.1 with a loss tangent of 0.009.

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1 Laxman, R. K., Semiconductor Intl. 18, 7174 (1995).
2 Singer, p., Semiconductor Intl. 19, 8896 (1996).
3 Savage, C. R., Timmons, R. B., and Lin, J. W., Chem. Mater. 3, 575577 (1991).
4 Savage, C. R., Timmons, R. B., and Lin, J. W., in Advances in Chemistry Series; Vol.236 (American Chemical Society, 1993), p. 745768.
5 Endo, K., MRS Bulletin 22, 5558 (1997).
6 Endo, K. and Tatsumi, T., J. Appl. Phys. 78, 13701372 (1995).
7 Lee, W. W. and Ho, P. S., MRS Bulletin 22, 1923 (1997).
8 Labelle, C. B., Limb, S. J., Gleason, K. K., and Bums, J. A., in Characterization of Pulsed-Plasma Enhanced Chemical Vapor Deposited Fluorocarbon Thin Films, Santa Clara, CA, 1997 (DUMIC), p. 98105.
9 Cobum, J. W. and Winters, H. F., Journal of Vacuum Science and Technology 16, 391 (1979).
10 d'Agostino, R., Capezzuto, P., Bruno, G., and Cramarossa, F., Pure and Applied Chemistry 57, 1287 (1985).
11 Yasuda, H., Plasma Polymerization (Academic Press, Inc., New York, 1985).
12 Yasuda, H., Macromol, J.. Sci.–Chem. A10, 383420 (1976).
13 Morosoff, N., Crist, B., Bumgarner, M., Hsu, T., and Yasuda, H., Macromol, J.. Sci.–Chemr. A10, 451471 (1976).
14 Labelle, C. B., Limb, S. J., and Gleason, K. K., J. Appl. Phys. 82, 17841787 (1997).
15 Limb, S. J., Edell, D. J., Gleason, E. F., and Gleason, K. K., Journal of Applied Polymer Science 67, 14891502 (1998).
16 Limb, J., Gleason, K. K., Edell, D. J., and Gleason, E. F., J. Vac. Sci. Technol. A 15, 18141818 (1997).
17 Knickelbein, M. B., Webb, D. A., and Grant, E. R., in New Devices for the Production of Intense Pulsed Jets of CF2: Laser Spectroscopic Characterization, Boston, MA, 1984 (Materials Research Society), p. 2333.
18 Limb, S. J., Labelle, C. B., Gleason, K. K., Edell, D. J., and Gleason, E. F., Appl. Phys. Lett. 68, 28102812 (1996).
19 C. Labelle, B., Karecki, S., Reif, R. R., and Gleason, K. K.. (manuscript in progress).
20 Lau, K. K. S. and Gleason, K. K., Journal of Physical Chemistry B 101, 6839 (1997).
21 K. Lau, K. S. and Gleason, K. K.. (submitted to J. Phys. Chem. B).
22 Martinez, R., Castano, F., Rayo, M. N. S., and Pereira, R., Chemical Physics 172, 349361 (1993).
23 Millward, G. E., Hartig, R., and Tschuikow-Roux, E., J. Phys. Chem. 75, 31953201 (1971).
24 Su, M.-C., Kumaran, S. S., Lim, K. P., Michael, J. V., and Wagner, A. F., J. Phys. Chem. 100, 1582715833 (1996).
25 Edwards, J. W. and Small, P. A., Nature 202, 1329 (1964).
26 Barnes, G. R., Cox, R. A., and Simmons, R. F., Journal of the Chemical Society (B) 6, 11761180 (1971).
27 Atkins, p. W., Physical Chemistry, 4th ed. (W. H. Freeman and Company, NY, NY, 1990).
28 Limb, S. J., Edell, D. J., Gleason, E. F., and Gleason, K. K.. (submitted to Chemistry of Materials).
29 d'Agostino, R., Cramarossa, F., Fracassi, F., and Illuzzi, F., in Plasma Deposition, Treatment, and Etching of Polymers, edited by R., d'Agostino (Academic Press, San Diego, CA, 1990), p. 95162.
30 Politanskii, S. F. and Shevchuk, V. U., Kinetika i Kataliz 9,496503 (1968).
31 Millward, G. E., Hartig, R., and Tschuikow-Roux, E., Journal of the Chemical Society, Chemical Communications, 465466 (1971).
32 Tserepi, A. D., Derouard, J., Booth, J. P., and Sadeghi, N., J. Appl. Phys. 81, 21242130 (1997).
33 McMurry, j., Organic Chemistry, 3rd ed. (Brooks/Cole Publishing Company, Pacific Grove, CA, 199).
34 Danilich, M. J., Burton, D. J., and Marchant, R. E., Vibrational Spectroscopy 9, 229234 (1995).
35 Silverstein, R. M., Bassler, G. C., and Morrill, T. C., Spectroscopic Identification of Organic Compounds, 5th ed. (Wiley & Sons, Inc., NY, NY, 1991).
36 Solymar, L. and Walsh, D., Lectures on the electrical properties of materials (Oxford University Press, New York, NY, 1984).
37 DiBenedetto, A. T., The Structure and Properties of Materials (McGraw-Hill Book Company, New York, NY, 1967).
38 Theil, J. A., Kooi, G., Mertz, F., Ray, G., and Seaward, K., in The Effect of Thermal Cycling on a-C:F,H Low Dielectric Constant Films Deposited by ECR Plasma Enhanced Chemical Vapor Deposition, San Francisco, CA, 1998.
39 Theil, J. A., Mertz, F., Yairi, M., Seaward, K., Ray, G., and Kooi, G., in Thermal Stabiility of a-C:F,H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition, San Francisco, CA, 1997 (Materials Research Society).

Pulsed Plasma Enhanced Chemical Vapor Deposition from CH2F2, C2H2F4, and CHCIF2

  • Catherine B. Labelle (a1), Kenneth K. S. Lau (a1) and Karen K. Gleason (a1)

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