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Properties Development During Curing of Low Dielectric-Constant Spin-On Glasses

Published online by Cambridge University Press:  10 February 2011

Robert F. Cook
Affiliation:
IBM Research, Yorktown Heights, NY 10598
Eric G. Liniger
Affiliation:
IBM Research, Yorktown Heights, NY 10598
David P. Klaus
Affiliation:
IBM Research, Yorktown Heights, NY 10598
Eva E. Simonyi
Affiliation:
IBM Research, Yorktown Heights, NY 10598
Stephan A. Cohen
Affiliation:
IBM Research, Yorktown Heights, NY 10598
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Abstract

Variations in the electrical and mechanical properties of silsesquioxane spin-on glass thin films are examined as a function of curing time and temperature. Particular attention is paid to the trade-off between producing low dielectric constant films, suitable for advanced microelectronic interconnection structures, and mechanically stable films, able to withstand semiconductor wafer fabrication processes. Two critical aspects of the mechanical stability of spin-on glasses are shown to be: the positive thermal expansion mismatch with silicon–leading to tensile film stresses; and reactivity with water–leading to susceptibility to stress-corrosion cracking.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

1. Lee, W. W. and Ho, P. S., MRS Bulletin 22, p. 19 (1997).Google Scholar
2. Edeistein, D. C., Sai-Halasz, G. A. and Mii, Y.-J. IBMJ. Res. Develop. 39, p. 383 (1995).Google Scholar
3. Baney, R. H., Itoh, M., Sakakibara, A. and Suzuki, T., Chem. Rev. 95, p. 1409 (1995).Google Scholar
4. Cook, R. F. and Liniger, E. G., in Low Dielectric Constant Materials and Applications in Microelectronics IV (this volume).Google Scholar