- Cited by 28
Zhao, Bin Wang, Shi-Qing Anderson, Steven Lam, Robbie Fiebig, Marcy Vasudev, P. K. and Seidel, Thomas E. 1996. On Advanced Interconnect Using Low Dielectric Constant Materials as Inter-Level Dielectrics. MRS Proceedings, Vol. 427, Issue. ,
Zhao, B. Wang, S.-Q. Fiebig, M. Anderson, S. Vasudev, P.K. and Seidel, T.E. 1996. Reliability and electrical properties of new low dielectric constant interlevel dielectrics for high performance ULSI interconnect. p. 156.
Harrus, A.S. Plano, M.A. Kumar, D. and Kelly, J. 1996. Parylene AF-4: A Low εR Material Candidate For ULSI Multilevel Interconnect Applications. MRS Proceedings, Vol. 443, Issue. ,
Murarka, Shyam P. 1997. Multilevel interconnections for ULSI and GSI era. Materials Science and Engineering: R: Reports, Vol. 19, Issue. 3-4, p. 87.
Homma, Tetsuya 1998. Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections. Materials Science and Engineering: R: Reports, Vol. 23, Issue. 6, p. 243.
Kurabayashi, K. and Goodson, K. E. 1999. Impact of molecular orientation on thermal conduction in spin-coated polyimide films. Journal of Applied Physics, Vol. 86, Issue. 4, p. 1925.
Endo, Kazuhiko Shinoda, Keisuke and Tatsumi, Toru 1999. Phenyl Silica Glass for Formation of Porous Dielectric Film. MRS Proceedings, Vol. 565, Issue. ,
Xu, Yuhuan Tsai, Yi-pin Tu, K. N. Zhao, Bin Liu, Q.-Z. Brongo, Maureen Sheng, George T. T. and Tung, C. H. 1999. Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant. Applied Physics Letters, Vol. 75, Issue. 6, p. 853.
Fodor, J.S. Briber, R.M. Russell, T.P. Carter, K.R. Hedrick, J.L. Miller, R.D. and Wong, A. 1999. Non-uniform composition profiles in thin film polymeric nanofoams. Polymer, Vol. 40, Issue. 10, p. 2547.
Kurabayashi, K. Asheghi, M. Touzelbaev, M. and Goodson, K.E. 1999. Measurement of the thermal conductivity anisotropy in polyimide films. Journal of Microelectromechanical Systems, Vol. 8, Issue. 2, p. 180.
Shi-jin, Ding Peng-fei, Wang Wei, Zhang Ji-tao, Wang Lee, Wei William Ye-wen, Zhang and Zhong-fu, Xia 2000. Porous amorphous fluoropolymer films with ultralow dielectric constant. Chinese Physics, Vol. 9, Issue. 10, p. 778.
Dang, T. D. Mather, P. T. Alexander, M. D. Grayson, C. J. Houtz, M. D. Spry, R. J. and Arnold, F. E. 2000. Synthesis and characterization of fluorinated benzoxazole polymers with highTg and low dielectric constant. Journal of Polymer Science Part A: Polymer Chemistry, Vol. 38, Issue. 11, p. 1991.
Williamson, J. and Wong, C.P. 2000. Wafer level batch packaging (WLBP): incorporation of air pores/foams in a polyimide matrix using a low modulus sacrificial commercial polymer. p. 319.
Chiu, Patrick G. Hsu, David T. Kim, Hyung-Kun Shi, Frank G. Nalwa, Hari Singh and Zhao, Bin 2001. Handbook of Advanced Electronic and Photonic Materials and Devices. p. 201.
Fahim, M. Bijwe, J. and Nalwa, Hari Singh 2001. Supramolecular Photosensitive and Electroactive Materials. p. 643.
Ding, Shi-Jin Wang, Peng-Fei Zhang, David Wei Wang, Ji-Tao and Lee, Wei William 2001. A novel structural amorphous fluoropolymer film with an ultra-low dielectric constant. Materials Letters, Vol. 49, Issue. 3-4, p. 154.
Xu, Yuhuan Zheng, D. W. Tsai, Yipin Tu, K. N. Zhao, Bin Liu, Q. Z. Brongo, Maureen Ong, Chung Wo Choy, Chung Loong Sheng, George T. T. and Tung, C. H. 2001. Synthesis and characterization of porous polymeric low dielectric constant films. Journal of Electronic Materials, Vol. 30, Issue. 4, p. 309.
Ding, Shi-Jin Wang, Peng-Fei Wan, Xin-Gong Zhang, David Wei Wang, Ji-Tao and Lee, Wei William 2001. Effects of thermal treatment on porous amorphous fluoropolymer film with a low dielectric constant. Materials Science and Engineering: B, Vol. 83, Issue. 1-3, p. 130.
Sadough-vanini, A. Yang, D. Q. Martinu, L. and Sacher, E. 2001. The Adhesion of Evaporated Copper to Dow Cyclotene 3022®, Determined by Microscratch Testing. The Journal of Adhesion, Vol. 77, Issue. 4, p. 309.
Lee, Choonkeun Shul, Yonggun and Han, Haksoo 2002. Dielectric properties of oxydianiline-based polyimide thin films according to the water uptake. Journal of Polymer Science Part B: Polymer Physics, Vol. 40, Issue. 19, p. 2190.
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Foamed polyimides have been developed in order to obtain thin film dielectric layers with very low dielectric constants for use in microelectronic devices. In these systems the pore sizes are in the nanometer range, thus, the term “nanofoam”. The polyimide foams are prepared from block copolymers consisting of thermally stable and thermally labile blocks, the latter being the dispersed phase. Foam formation is effected by thermolysis of the thermally labile block leaving pores the size and shape corresponding to the initial copolymer morphology. Nanofoams prepared from a number of polyimides as matrix materials, were investigated as well as a number of thermally labile polymers. The foams were characterized by a variety of experiments including, TEM, SAXS, WAXD, DMTA, density measurements, refractive index measurements and dielectric constant measurements. Thin film foams, with high thermal stability and dielectric constants approaching 2.0, can be prepared using the copolymer/nanofoam approach.
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