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Polyimide for Multichip Modules: Materials and Process Challenges

Published online by Cambridge University Press:  15 February 2011

T. Rucker ,
V. Murali ,
R. Shukla  and
H. Neuhaus
T. Rucker
Affiliation:
Intel Corp., Santa Clara, CA
V. Murali
Affiliation:
Intel Corp., Santa Clara, CA
R. Shukla
Affiliation:
Intel Corp., Santa Clara, CA
H. Neuhaus
Affiliation:
Amoco Chemical Co., Naperville, Il
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Abstract:

As the performance of desk-top systems approaches 100 Mhz there is a need to develop a packaging technology capable of supporting high speed chip to chip interconnections. Polyimide based multichip modules are excellent packaging solutions that have minimum propagation delays and are cost effective. This paper presents the material properties and processing issues that need to be addressed in building reliable modules. A cost effective and reliable packaging solution is described in detail.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 71
Copyright
Copyright © Materials Research Society 1992

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References

References:

1. Bakoglu, H., Circuits, Interconnections, and Packaging for VLSI, 1st ed. (Addison Wesley VLSI Systems Series, New York)Google Scholar
2. Tummala, R., Rymaszewski, E., Microelectronic Packaging Handbook. 1st ed. (Van Norstrand Reinhold, New York) pp 700–725, 360 – 390.Google Scholar
3. Teresawa, M., Minami, S., J Rubin, Int. Jour. Hybrid Microelectronics, 6, ppl–11, 1983 Google Scholar
4. Burdeaux, D., Townsend, P., Carr, J., Garrou, P., J. Electonic Materials, Vol 12, No 12. 1990, p1357 CrossRefGoogle Scholar
5. Jensen, R., Recent Advances in Thin Film Multilayer Interconnect Technology for IC Packaging, edited by Jacodine, R., Jackson, K., and Sundahl, R. (Mat. Res. Soc. Proc, Pittsburgh PA, 1988) p73 Google Scholar
6. Blonder, G., Gottscho, R., Tai, K., AT&T Technical Journal, Nov/Dec 1990. p46CrossRefGoogle Scholar
7. Shukla, R., Rucker, T., Murali, V., in A Wet Polyimide Process for MCMs. Proceedings of 1st International Conference on MCM, April 1992, Denver p 251Google Scholar
8. Murali, V., Rucker, T., Shukla, R., Fu, J. presented at the MCMC Conference, March 1992, Santa Cruz Ca.Google Scholar
9. Strohmeier, B., J. Vac. Sci. Technology A 8 (4), July/Aug 1990, p 3347–3349 CrossRefGoogle Scholar
10. Murali, V., presented at the IRPS Symposium, San Diego, March 1992.Google Scholar