Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-19T20:38:18.600Z Has data issue: false hasContentIssue false
  • English
  • Français

Polyimide Considerations In Thin-Film Electronic Packaging

Published online by Cambridge University Press:  15 February 2011

W. P. Pawlowski
W. P. Pawlowski*
Affiliation:
IBM, Systems Technology Division, 1701 North St., Endicott, NY 13760
Get access

Abstract

Free-standing polyimide film is used extensively in tape automated bonding (TAB) and flexible printed circuit (Flex) applications because of its excellent chemical, mechanical, and electrical properties. Kapton polyimide film has been the material of choice for many years. Recently, a new polyimide film, Upilex, has been introduced into the marketplace. The primary property differences between Kapton and Upilex result from differences in the chemical composition of each film. A review of property/product performance indicates that Upilex S is preferred with respect to dimensional stability, metal/polyimide and adhesive/polyimide adhesion, chemical inertness and glass transition temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 247
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Pawlowski, W.P., Jaccobson, M.l., Teixeira, M.E., and Sakorafos, K.G., in Solvent Diffusion in Selected Polyirnide Films, edited by Barknecht, A.T.,. Partridge, J.P., Chen, C.J., Li, C.Y. (Mater. Res. Soc. Proc. 167, Boston, MA 1989) pp. 147–152.Google Scholar
2. Holzinger, S., TAB: Mechanical, Chemical, and Thermal Considleratiomns for Three Layer TAB Materials, Presentedl at EXPO SMT International, Las Vegas, NV, 1989.Google Scholar