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Plasticity in Polycrystalline Thin Films: a 2D Dislocation Dynamics Approach

Published online by Cambridge University Press:  15 February 2011

Lucia Nicola ,
Erik Van der Giessen  and
Alan Needleman
Lucia Nicola
Affiliation:
The Netherlands Institute for Metals Research/Dept. of Applied Physics, University of Groningen, Nyenborgh 4, 9747 AG Groningen, The Netherlands
Erik Van der Giessen
Affiliation:
The Netherlands Institute for Metals Research/Dept. of Applied Physics, University of Groningen, Nyenborgh 4, 9747 AG Groningen, The Netherlands
Alan Needleman
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912, USA
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Abstract

Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film–substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 779: Symposium W – Multiscale Phenomena in Materials - Experiments and Modeling Related to Mechanical Behavior , 2003 , W5.20
Copyright
Copyright © Materials Research Society 2003

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References

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