Skip to main content Accessibility help

Plastic Relaxation in Thin Copper Films

  • Jonathan B. Shu (a1) and Shefford P. Baker (a1)


We have studied the isothermal relaxation behavior of 500 nm Cu films with SiNx passivation and barrier layers on Si substrates. Oxygen content in the Cu films was varied by deposition in various oxygen partial pressures in the range 10-10 to 10-4 Torr. The substrate curvature method was used to investigate the thermomechanical behavior of the Cu films. Isothermal relaxation experiments were performed in the temperature range 50-175°C. Comparison with constitutive creep deformation equations shows that the relaxation data in this temperature range are well described by power law behavior. Under certain isothermal conditions related to temperature, stress, and thermal history, anelastic recovery was observed– i.e. while in a tensile stress state and with the temperature held constant, the overall film stress was seen to increase over a relatively short time scale.



Hide All
1. Baker, S. P., Keller, R.-M., and Arzt, E. in Thin-Films - Stresses and Mechanical Properties VI,. (Mater. Res. Soc. Proc., 1998) pp. 605–10.
2. Keller, R.-M., Baker, S. P., and Arzt, E., JMR 13, 1307–17 (1997).
3. Shu, J., Clyburn, S., Mates, T., and Baker, S. P. in Materials Reliability in Microelectronics IX, (Mater. Res. Soc. Proc., 1998), pp. 207–12.
4. Weiss, D., PhD Thesis, Universität Stuttgart, 2000.
5. Thouless, M. D., Rodbell, K. P., and Cabral, J. C., J. Vac. Sci. Tech. A 14, 2454–61 (1996).
6. Keller, R.-M., Baker, S. P., and Arzt, E., Acta Mater. 47, 415426 (1998).
7. Frost, H. J. and Ashby, M. F., Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics, (Pergamon Press, New York, 1982).
8. Stoney, G. G., Proc. R. Soc. A82, 172175 (1909).
9. Thouless, M. D., Gupta, J., and Harper, J. M. E., J. Mater. Res. 8, 18451852 (1993).
10. Nowick, A. S. and Berry, B. S., Anelastic Relaxation in Crystalline Solids (Academic Press, New York, 1972).
11. Baker, S. P., Keller, R.-M., and Shu, J. B., (unpublished).
12. Vinci, R. P., Cornella, G., and Bravman, J. C., AIP Proceedings: Stress Induced Phenomena in Metallization, 240248 (1999).
13. Spolenak, R., Volkert, C. A., Ziegler, S., Panofen, C., and Brown, W. L., MRS Symp. Proc. 673, 1.4.1-1.4.6 (2001).
14. Spolenak, R., Tamura, N., Valek, B. C., MacDowell, A.A., Celestre, R. S., Padmore, H. A., Brown, W.L., Marieb, T., Batterman, B.W., and Patel, J.R., AIP Proceedings: Stress-Induced Phenomena in Metallizations, 2001 (in press).
15. Baker, S. P., Keller, R.-M., Kretschmann, A., and Arzt, E., MRS Symp. Proc 516 (1998).

Related content

Powered by UNSILO

Plastic Relaxation in Thin Copper Films

  • Jonathan B. Shu (a1) and Shefford P. Baker (a1)


Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed.