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Numerical Derivative Analysis of Load-Displacement Curves in Depth-Sensing Indentation

Published online by Cambridge University Press:  01 February 2011

Tom Juliano ,
Vladislav Domnich ,
Tom Buchheit  and
Yury Gogotsi
Tom Juliano
Affiliation:
Department of Materials Science and Engineering Drexel University, Philadelphia, PA 19104, USA
Vladislav Domnich
Affiliation:
Department of Materials Science and Engineering Drexel University, Philadelphia, PA 19104, USA
Tom Buchheit
Affiliation:
Department of Microsystems, Materials, Tribology and Technology - Sandia National Laboratories, Albuquerque, NM 87185, USA
Yury Gogotsi
Affiliation:
Department of Materials Science and Engineering Drexel University, Philadelphia, PA 19104, USA
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Abstract

The use of load-displacement derivative behavior and power-law curve fitting is applied to find the location of events for a number of different materials during depth-sensing indentation. Load-displacement curves for Berkovich indentations on fused silica, fullerene thin film on sapphire, CdTe thin film on silicon, single crystal silicon, carbide derived carbon, and a polymethylmethacrylate/hydroxyapatite (PMMA/HA) particle composite are examined. The analysis is applied to quantify the location of different events that occur during material loading and unloading.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 791: Symposium Q – Mechanical Properties of Nanostructured Materials and Nanocomposites , 2003 , Q7.5
Copyright
Copyright © Materials Research Society 2004

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References

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