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Novel Reducing Chemistry for Supercritical Fluid Deposition of Copper

Published online by Cambridge University Press:  01 February 2011

Takeshi Momose ,
Tomohiro Ohkubo ,
Masakazu Sugiyama  and
Yukihiro Shimogaki
Takeshi Momose
Affiliation:
momo@dpe.mm.t.u-tokyo.ac.jp, The University of Tokyo, Department of Materials Engineering,, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan, Tokyo, Tokyo, 113-8656, Japan
Tomohiro Ohkubo
Affiliation:
ohkubo@dpe.mm.t.u-tokyo.ac.jp, The University of Tokyo, Department of Materials Engineering,, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Tokyo, 113-8656, Japan
Masakazu Sugiyama
Affiliation:
sugiyama@ee.t.u-tokyo.ac.jp, The University of Tokyo, Department of Electronic Engineering, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Tokyo, 113-8656, Japan
Yukihiro Shimogaki
Affiliation:
shimo@dpe.mm.t.u-tokyo.ac.jp, The University of Tokyo, Department of Materials Engineering,, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Tokyo, 113-8656, Japan
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Abstract

We study new deposition chemistry in Cu-SCFD (supercritical fluid deposition), especially effect of acetone is investigated as reducing agent and additives into H2 reducing Cu-SCFD. Acetone reduction yields Cu film deposition onto Ru coated Si substrate, because Ru has catalytic effect to generate reducing agent from acetone. When acetone is added into H2 reducing chemistry, the solubility of precursor is enhanced approximately 50 %, which is so-called “entrainer effect”. Ethanol can enhance the deposition of Cu in H2 reduction chemistry, which is a solvent effect. Two effects of entrainer effect by acetone and solvent effect by ethanol works independently, without interfering each other.

Keywords

Cufilmchemical reaction
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F09-20
Copyright
Copyright © Materials Research Society 2006

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References

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