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A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films

  • Kazuo Kohmura (a1), Shunsuke Oike (a1), Masami Murakami (a1), Hirofumi Tanaka (a1), Syozo Takada (a2), Yutaka Seino (a3) and Takamaro Kikkawa (a3) (a4)...

Abstract

A novel organosiloxane-vapor-annealing method has been developed for improving the mechanical strength of porous silica films with a low dielectric constant. Treatment of a porous silica film with 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) under atmospheric nitrogen above 350 °C significantly enhanced the mechanical strength (i.e., elastic modulus and hardness) of the film. Results of Fourier transform infrared spectroscopy (FT-IR) and thermal desorption spectroscopy (TDS) suggested the formation of cross-linked poly(TMCTS) network on the porous silica internal wall surfaces by the TMCTS treatment. Such TMCTS cross-linked network is thought to enhance the mechanical strength of the low-k film.

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A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films

  • Kazuo Kohmura (a1), Shunsuke Oike (a1), Masami Murakami (a1), Hirofumi Tanaka (a1), Syozo Takada (a2), Yutaka Seino (a3) and Takamaro Kikkawa (a3) (a4)...

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