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Novel Noncontact Thickness Metrology for Partially Transparent and Nontransparent Wafers for Backend Semiconductor Manufacturing

  • Wojciech J. Walecki (a1), Vitali Souchkov (a1), Kevin Lai (a1), Phuc Van (a1), Manuel Santos (a1), Alexander Pravdivtsev (a1), S. H. Lau (a1) and Ann Koo (a1)...

Abstract

Single probe infrared low coherence optical interferometry has been proven to be an effective tool for characterization of thin and ultra-thin semiconductor Si and compound materials wafers. Its application was however limited to wafers transparent at probing wavelength, and having relatively smooth surfaces. Purpose of this paper is to present an extension of low coherence interferometry to characterization of non-transparent wafers, and wafers with rough surfaces.

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1. Huang, D., Swanson, E. A., Lin, C. P., Schuman, J. S., Stinson, W. G., Chang, W., Hee, M. R., Flotte, T., Gregory, K., Puliafito, C. A., Fujimoto, J. G., Science 254, 1178 (1991).
2. Walecki, W.J., Lu, R., Lee, J., Watman, M., Lau, S.H., Koo, A., 3 rd International Workshop on Thin Semiconductor Devices - Manufacturing and Applications November 25, 2002, Munich, Germany.
3. Creath, K., Progress in Optics XXVI, Wolf, E., Ed., Elsevier Science Publishers, Amsterdam, p. 349 (1988)
4. Caber, P.J., Applied Optics 32, 3438 (1993).
5. Cohen, D.K. et al. 1992, U.S. Patent No. 5,133,601.
6. Dorsch, Rainer G., Hausler, Gerd, and Herrmann, Jurgen M., Applied Optics 33, 1306 (1994).
7. Walecki, W., Wei, F., Van, P., Lai, K., Lee, T., Lau, SH, and Koo, A., in Reliability, Testing and Characterisation of MEMS/MOEMS III, edited by Tanner, D. M., Ramesham, R., Proceedings of SPIE 5343, 55 (2003).
8. Walecki, W., “Low Coherence Interferometry Based Metrologies for MEMs Manufacturing”, SEMI Technology Symposium: Innovations in Semiconductor Manufacturing (STS: ISM) July 13, 2004 San Francisco.
9. Walecki, W., “Non-Contact Fast Wafer Metrology for Ultra-Thin Patterned Wafers Mounted on Grinding and Dicing Tapes”, SEMI Technology Symposium: International Electronics Manufacturing Technology (STS: IEMT), July 16, San Jose (2004).
10. Walecki, W., Wei, F., Van, P., Lai, K., Lee, T., Lau, SH, Koo, A., “Progress in optical ultra-thin wafer metrology” 4th International Workshop on Thin Semiconductor Devices – Manufacturing and Applications November 25, 2003, Munich, Germany.
11. Walecki, W.J., Lu, R., Lee, J., Watman, M., Lau, S.H., Koo, A., “Novel non-contact wafer mapping and stress metrologies for thin and ultrathin chip manufacturing applications” 3rd International Workshop on Thin Semiconductor Devices – Manufacturing and Applications November 25, 2002, Munich, Germany.

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