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Nondestructive defect measurement and surface analysis of 3C-SiC on Si (001) by electron channeling contrast imaging

  • Yoosuf N. Picard (a1), Christopher Locke (a2), Christopher L. Frewin (a3), Rachael L. Myers-Ward (a4), Joshua D. Caldwell (a5), Karl D. Hobart (a6), Mark E. Twigg (a7) and Stephen E. Saddow (a8)...


The electron channeling contrast imaging (ECCI) technique was utilized to investigate atomic step morphologies and dislocation densities in 3C-SiC films grown by chemical vapor deposition (CVD) on Si (001) substrates. ECCI in this study was performed inside a commercial scanning electron microscope using an electron backscatter diffraction (EBSD) system equipped with forescatter diode detectors. This approach allowed simultaneous imaging of atomic steps, verified by atomic force microscopy, and dislocations at the film surface. EBSD analysis verified the orientation and monocrystalline quality of the 3C-SiC films. Dislocation densities in 3C-SiC films were measured locally using ECCI, with qualitative verification by x-ray diffraction. Differences in the dislocation density across a 50 mm diameter 3C-SiC film could be attributed to subtle variations during the carbonization process across the substrate surface.



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