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Non-Contact Characterization of Recombination Processes in 4H-SiC

Published online by Cambridge University Press:  15 March 2011

K. Matocha
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing Rensselaer Polytechnic Institute, Troy, NY, USA
T.P. Chow
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing Rensselaer Polytechnic Institute, Troy, NY, USA
R.J. Gutmann
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing Rensselaer Polytechnic Institute, Troy, NY, USA
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Abstract

Carrier decay transients in 4H-SiC n-type and p-type epilayers have been charac-terized using a non-destructive, non-contact microwave photoconductivity technique. Decay transients show a two-stage exponential decay with first decay constants as high as 400 ns in 10 νm p-type epilayers. The second decay constant increases with temperature and is dominated by interface recombination.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

[1] Kordina, O., Bergman, J. P., Hallin, C., and Janzéen, E., Appl. Phys. Letters 69, 679 (1996).Google Scholar
[2] Bergman, J. P., Kordina, O., and Janzén, E., Phys. stat. sol. (a) 162, 65 (1997).Google Scholar
[3] Galeckas, A., Grivickas, V., Linnros, J., Bleichner, H., and Hallin, C., J. Appl. Phys. 81, 3522 (1997).Google Scholar
[4] Galeckas, A., Linnros, J., Grivickas, V., Lindefelt, U., and Hallin, C., Mat. Science Forum 264–268, 533 (1998).Google Scholar
[5] Galeckas, A., Tornblad, O., Linnros, J., and Breitholtz, B., IEEE Electron Device Letters 20, 295 (1999).Google Scholar
[6] Galeckas, A., Linnros, J., Frischholz, M., Rottner, K., Nordell, N., Karlsson, S., and Grivickas, V., Mat. Sci. and Eng. (B) B61–62, 239 (1999).Google Scholar
[7] Kimoto, T., Miyamoto, N., and Matsunami, H., IEEE Trans. Electron Devices 46, 471 (1993).Google Scholar
[8] Neudeck, P. G., J. Elec. Mat. 27, 317 (1998).Google Scholar
[9] Ichimura, M., Tajiri, H., Morita, Y., Yamada, N., and Usami, A., Appl. Phys. Lett. 70, 1745 (1997).Google Scholar
[10] Sridhara, S. G., Eperjesi, T. J., Devaty, R. P., and Choyke, W. J., Mat. Sci. and Eng. (B) B61–62, 229 (1999).Google Scholar
[11] Saroop, S., Borrego, J. M., Gutmann, R. J., Charache, G. W., and Wang, C. A., J. Appl. Phys. 86, 1527 (1999).Google Scholar
[12] Ahrenkiel, R. K. and Lundstrom, M. S., Minority Carriers in III-V Semiconductors: Physics and Applications (Academic Press, New York, 1993).Google Scholar