Hostname: page-component-77c89778f8-n9wrp Total loading time: 0 Render date: 2024-07-18T10:53:33.334Z Has data issue: false hasContentIssue false
  • English
  • Français

New Process and Materials Developments in 3-Dimensional Printing, 3DP™

Published online by Cambridge University Press:  10 February 2011

S. A. Uhland ,
R. K. Holman ,
M. J. Cima ,
E. Sachs  and
Y. Enokido
S. A. Uhland
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02139
R. K. Holman
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02139
M. J. Cima
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02139
E. Sachs
Affiliation:
Massachusetts Institute of Technology, Cambridge, MA 02139
Y. Enokido
Affiliation:
TDK U.S.A. Corporation, Port Washington, NY 11050
Get access

Abstract

The Three-Dimensional Printing (3DP™) process has been modified to incorporate colloidal science for the fabrication of fine ceramic parts. Complex shaped alumina and silicon nitride components have been formed directly from 3-dimensional CAD files using submicron powders. Parts were built using a sequential layering process of the ceramic slurry followed by ink jet printing of a binder system. A well dispersed slurry and optimized printing parameters are required to form a uniform powder bed with a high green density. Liquid-powder bed interactions affect the geometry and internal structure of the component. The redispersion of the unprinted powder bed is critical in order to retrieve the printed components. The slurry and powder bed chemistry are the major factors controlling powder bed redispersion. The process is generic and can be readily adapted for new materials systems. Our research is currently focused on the fabrication of dielectric RF filters. Preliminary results have demonstrated the ability to successfully fabricate cylindrical RF resonators.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 542: Symposium V – Solid Freeform and Additive Fabrication , 1998 , 153
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Sachs, E., Cima, M., Cornie, J., Brancazio, D., Bredt, J., Curodeau, A., Fan, T., Khanuja, S., Lauder, A., Lee, J., Michaels, S., Annals of the CIRP, 42, pp. 257–260 (1993).Google Scholar
2 Grau, J., Moon, J., Uhland, S., Cima, M., Sachs, E., Proceedings of the Solid Freeform Fabrication Symposium, (August 11-13, 1997).Google Scholar
3 Grau, J., Moon, J., Uhland, S., Cima, M., Sachs, E. M., J. Amer. Ceram. Soc., in print, (1998).Google Scholar
4 Moon, J., Grau, J., Knezevic, V., Cima, M., Sachs, E., to be submitted J. Amer. Ceram. Soc., (1998).Google Scholar
5 Grau, J., Moon, J., Cima, M., Sachs, E., to be submitted J. Amer. Ceram. Soc., (1998).Google Scholar
6 Kobayashi, Y., Kato, M., IEEE TMTT, MTT-33, 7, 1985.Google Scholar
7 Aksay, I., Schilling, C., Proceedings of the 85th Annual Meeting of the Amer. Ceram. Soc., 9, pp. 85–93 (1984).Google Scholar