Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-26T14:07:16.061Z Has data issue: false hasContentIssue false

A New Electrically Reversible Depassivation/Passivation Mechanism in Polycrystalline Silicon

Published online by Cambridge University Press:  10 February 2011

Vyshnavi Suntharalingam
Affiliation:
Electronic Materials and Processing Research Laboratory, The Pennsylvania State University, University Park, PA 16802,
Stephen J. Fonash
Affiliation:
Electronic Materials and Processing Research Laboratory, The Pennsylvania State University, University Park, PA 16802,
Get access

Abstract

An electrically reversible depassivation/passivation phenomenon, recently found for hydrogen passivated polysilicon [1] is further explored in this report. This reversible effect is seen in both ECR and RE hydrogen passivated n-channel thin film transistors (TFTs) but is not seen in the corresponding hydrogen passivated pchannel TFrs, nor is it seen in either n- or p-channel TETs before hydrogenation. This phenomenon has been observed when room temperature bias stressing TFTs fabricated on solid phase or laser crystallized polysilicon films on quartz substrates [1]. A model involving hydrogen release or capture at defects, positively charged hydrogen motion in device electric fields, and subsequent hydrogen capture at other defects has been proposed. This phenomenon has significant implications for polycrystalline silicon TFT’ design and operation. By extension, it also offers significant insight into the stability problems of hydrogenated amorphous silicon.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Suntharalingam, V. and Fonash, S. J., Appl. Phys. Lett. 68, 1400 (1996).Google Scholar
[2] Dimitriadis, C.A. and Coxon, P.A., Appl. Phys. Lett. 54, 620 (1989).Google Scholar
[3] Young, N.D. and Gill, A., Semicond. Sci. Technol. 5, 72 (1990).Google Scholar
[4] Wu, I.-W., Jackson, W.B., Huang, W.B., Hyang, T.-Y, Lewis, A.G., and Chiang, A., IEEE Electron Device Lett. 11, 167 (1990).Google Scholar
[5] Rodder, M.S. and Antoniadis, D.A., IEEE Trans. Electron Devices ED–34, 1079 (1987).Google Scholar
[6] Banerjee, S., Sundarasen, R., Shichijo, H., and Malhi, S., IEEE Trans. Electron Devices ED–35, 152 (1988).Google Scholar
[7] Ayres, J.R. and Young, N.D., IEE Proc. Circuits Devices Syst. 141, 38 (1994).Google Scholar
[8] Young, N.D. and Gill, A., Semicond. Sci. Technol. 7, 1103 (1992).Google Scholar
[9] Awadelkarim, O.O., Fonash, S. J., Mikulan, P. I., and Chan, Y.D., J. Appl. Phys. 79, 517 (1996).Google Scholar
[10] Street, R.A., Physica B 170, 69 (1990).Google Scholar
[11] Kim, Y.S., Choi, K.Y., Jun, M.C., and Han, M.K., Mat. Res. Soc. Symp. Proc., 345, 155 (1994).Google Scholar
[12] Lewis, A.G., Wu, I.-W., Huang, T.Y., Chiang, A., and Bruce, R.H., IEDM Tech. Dig., 843 (1990).Google Scholar