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Nanoscratch Behavior of Sputtered Metal Films on PAMAM Dendrimer Monolayers

Published online by Cambridge University Press:  17 March 2011

Feng-Ting Xu ,
Mike Curry ,
Feng Huang ,
Ping-Ping Ye ,
Andrei Rar ,
Shane C. Street  and
John A. Barnard
Feng-Ting Xu
Affiliation:
Department of Metallurgical and Materials EngineeringThe University of Alabama, Tuscaloosa, AL 35487-0209
Mike Curry
Affiliation:
Department of Chemistry, The University of Alabama, Tuscaloosa, AL 35487-0209
Feng Huang
Affiliation:
Department of Metallurgical and Materials EngineeringThe University of Alabama, Tuscaloosa, AL 35487-0209
Ping-Ping Ye
Affiliation:
Department of Chemistry, The University of Alabama, Tuscaloosa, AL 35487-0209
Andrei Rar
Affiliation:
The Center for Materials for Information Technology (MINT Center), The University of Alabama, Tuscaloosa, AL 35487-0209
Shane C. Street
Affiliation:
Department of Chemistry, The University of Alabama, Tuscaloosa, AL 35487-0209
John A. Barnard
Affiliation:
Department of Materials Science and EngineeringUniversity of Pittsburgh, Pittsburgh, PA 15261
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Abstract

Striking differences have been observed in the deformation modes associated with 2mN constant load nanoscratch events on ultrathin Cr layers deposited on SiOx with and without a dendrimer interlayer. In the absence of the dendrimer distinct ridge formation along the wear track indicative of plowing and wedge formation are observed. By contrast, dendrimer monolayer-mediated films exhibit ridgeless scratches apparently formed in a nearly pure cutting mode. In addition, the width of the scratch trench in the sample without dendrimer is larger than the one with dendrimer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 710: Symposia DD – Polymer Interfaces and Thin Films , 2001 , DD14.4.1
Copyright
Copyright © Materials Research Society 2002

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References

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