Skip to main content Accessibility help
×
Home

Nanoindentation Hardness of Soft Films on Hard Substrates: Effects of the Substrate

  • T. Y. Tsui (a1), C. A. Ross (a2) and G. M. Pharr (a3)

Abstract

The ability to accurately measure the mechanical properties of thin metallic films is important in the semiconductor industry as it relates to device reliability issues. One popular technique for measuring thin film mechanical properties is nanoindentation. This technique has the advantage of being able to measure properties such as hardness and elastic modulus without removing a film from its substrate. However, according to a widely-held rule of thumb, intrinsic film properties can be measured in a manner which is not influenced by the substrate only if the indentation depth is kept to less than 10% of the film thickness, which is often not practical. In this work, a method for making substrate independent hardness measurements of soft metallic films on hard substrates is proposed. The primary issue to be addressed is the substrate-induced enhancement of indentation pile-up and the ways in which this pile-up influences the contact area determined from analyses of nanoindentation load-displacement data. Based on experimental observations of soft aluminum films on silicon, glass, and sapphire substrates, a simple empirical relationship is derived which relates the amount of pile-up to the contact depth. From this relationship, a simple method is developed which allows the intrinsic hardness of the film to be measured by nanoindentation methods even when the indenter penetrates through the film into the substrate.

Copyright

References

Hide All
1. Tsui, T.Y., Oliver, W.C., and Pharr, G.M., J. Mater. Res. 11, 752 (1996).
2. Tsui, T.Y., Oliver, W.C., and Pharr, G.M., Mater. Res. Soc. Symp. Proc. 436, 207 (1996).
3. Laursen, T.A. and Simo, J.C., J. Mater. Res. 7, 618 (1992).
4. Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).
5. Tsui, T.Y., Bolshakov, A., and Pharr, G.M., in preparation.
6. Stone, D., LaFontaine, W.R., Alexopoulos, P., Wu, T.W., and Li, C.-Y., J. Mater. Res 3, 141 (1988).
7. LaFontaine, W.R., Yost, B., and Li, C.-Y., J. Mater. Res. 5, 776 (1990).
8. Bhattacharya, A.K. and Nix, W.D., Int. J. Solid Structure 24, 1287 (1988).
9. Burnett, P.J. and Rickerby, D.S., Thin Solid Film 148, 41 (1987).
10. Burnett, P.J. and Rickerby, D.S., Thin Solid Films 148, 51 (1987).
11. Jonsson, B. and Hogmark, S., Thin Solid Films 114, 257 (1984).

Related content

Powered by UNSILO

Nanoindentation Hardness of Soft Films on Hard Substrates: Effects of the Substrate

  • T. Y. Tsui (a1), C. A. Ross (a2) and G. M. Pharr (a3)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed.