Hostname: page-component-8448b6f56d-m8qmq Total loading time: 0 Render date: 2024-04-23T08:46:13.862Z Has data issue: false hasContentIssue false

Nanoconfinement Effect on the Mechanical Behavior of Polymer Thin Films

Published online by Cambridge University Press:  01 February 2011

J. Zhou
Affiliation:
Department of Mechanical Engineering, University of California, Berkeley, CA 94720
K. Komvopoulos
Affiliation:
Department of Mechanical Engineering, University of California, Berkeley, CA 94720
Get access

Abstract

Nanoimprint is one of the most promising fabrication techniques for nanoelectronics. The main feature of this process is the compression of a thin film of a polymer resist by a rigid mold to produce a surface pattern. Hence, nanoimprint is essentially a mechanical forming process that depends greatly on the nanoscale mechanical behavior of the plastically deformed polymer film. Consequently, basic understanding of nanoimprint mechanics is imperative for improving pattern quality, reproducibility, and automation. The objective of this study was to elucidate the mechanical response of thin polymer films subjected to nanoindentation loading. Three deformation regimes were identified in the experiments performed with poly(methyl methacrylate) (PMMA) films of thickness in the range of 200-400 nm with a Berkovich tip of nominal radius of curvature equal to 100 nm. A three-layer model consisting of surface, intermediate, and interface layers was introduced to explain the mechanical response of the indented PMMA films. The spatial constraints imposed to the plastic flow of the interface layer by the rigid indenter and substrate surfaces produce a dynamic effect, demonstrated by the loading rate dependence of the deformation response. This phenomenon is of great importance to polymer plastic flow in nanoimprinting.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Chou, S. Y., Krauss, P. R., and Renstrom, P. J., Science 272, 85 (1996).Google Scholar
2 Cross, G. L.W., O'Connell, B. S., Pethica, J. B., and Oliver, W., Proc. IEEE-Nano 2003, 494 (2003).Google Scholar
3 Cross, G. L.W., O'Connell, B. S., and Pethica, J. B., Appl. Phys. Lett. 86, 081902 (2005).Google Scholar
4 Cross, G. L.W., O'Connell, B. S., Langford, R. M., and Pethica, J. B., Mater. Res. Soc. Symp. Proc. 841, R1.6 (2005).Google Scholar
5 Khang, D. Y., Yoon, H., and Lee, H. H., Adv. Mater. 13, 749 (2001).Google Scholar
6 Hong, P. S. and Lee, H. H., Appl. Phys. Lett. 83, 2441 (2003).Google Scholar
7 Gennes, P. G. De, Eur. Phys. J. E 2, 201 (2000).Google Scholar
8 Zanten, J. H. van, Wallace, W. E., and Wu, W. L., Phys. Rev. E 53, R2053 (1996).Google Scholar
9 Kawana, S. and Jones, R. A. L., Phys. Rev. E 63, 021501 (2001).Google Scholar
10 Ellison, C. J. and Torkelson, J. M., Nature 425, 695 (2003).Google Scholar
11 Oliver, W. C. and Pharr, G. M., J. Mater. Res, 7, 1564 (1992).Google Scholar
12 Mansfield, K. F. and Theodorou, D. N., Macromolecules 24, 6283 (1991).Google Scholar
13 Baschnagel, J. and Binder, K., Macromolecules 28, 6806 (1995).Google Scholar
14 Frank, C. W., Rao, V., Despotopoulou, M. M., Pease, R. F. W., Hinsberg, W. D., Miller, R. D., and Rabolt, J. F., Science 273, 912 (1996).Google Scholar
15 Jones, R. L., Kumar, S. K., Ho, D. L., Briber, R. M., and Russell, T. P., Nature 400, 146 (1999).Google Scholar
16 DeMaggio, G. B., Frieze, W. E., Gidley, D. W., Zhu, M., Hristov, H. A., and Yee, A. F., Phys. Rev. Lett. 78, 1524 (1997).Google Scholar
17 Saha, R. and Nix, W. D., Acta Materialia 50, 23 (2002).Google Scholar
18 and, T. Y. Tsui Pharr, G. M., J. Mater. Res. 14, 292 (1999).Google Scholar