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Multiple Cracks of a Thin Film on a Ductile Substrate

  • Ming-Hao Zhao (a1), Ran Fu (a1) and Tong-Yi Zhang (a1)

Abstract

The present work proposes a Dugdale type model to theoretically predict the multiple cracks of a residually tensile stressed thin film on a ductile substrate. The results show that there exists a critical value, Rc, of the cracking resistance number, R. When R < R, the film > c cracks and the normalized crack spacing is determined by cracking resistance number and the stress ratio of the residual stress to the yield strength of the substrate.

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