Skip to main content Accessibility help
×
Home

Multilayer structure, stress reduction and annealing of carbon film.

  • Peter C.T. Ha (a1), D. R. McKenzie (a1), D. Doyle (a2), D. G. McCulloch (a3) and Richard Wuhrer (a4)...

Abstract

Carbon films deposited by filtered cathodic arc show a high compressive stress which limits their thickness because of delamination. We study three methods of relieving the stress in these films. We first determine the dependence of the stress on DC bias up to bias voltages of 1200V and show that the formula of Davis provides a good fit to the data including the stress maximum in the region of 150–200V and the progressive decrease in stress at higher voltages. In the second method, plasma immersion ion implantation (PIII) was used to create multilayer of alternating high density, high stress (PIII on) films and lower density, low stress (PIII off) films. This method enabled thicker structures to be produced. In the third method we made multilayers using amorphous silicon and carbon layers. Annealing of these layers showed that the stress could be reduced to very low values because of the ability of the silicon layers to absorb compressive stress by contracting after the annealing step. The microstructural effects of PIII were studied by transmission and scanning electron microscopy.

Copyright

References

Hide All
1. Zhang, X., Yi, Z., Zhang, T., Wu, X., Wang, G. and Zhang, H., Surface and Coatings Technology, 161, p. 120124, (2002).
2. Makarov, A., Korshunov, L. and Solodova, I., Journal of Friction and Wear, 21, 5, p. 3543, (2000).
3. Feng, M., Xun, C., Gang, L., Qiu-long, C. and Hong-ta, M., Journal of Materials Science & Technology, 18, 5, p. 447–50, (2002).
4. Feng, M., Xun, C., Qiu-long, C., Gang, L. and Hong-ta, M., Journal of Shanghai Jiaotong University, 37, 2, p. 248–51, (2003).
5. Sheeja, D., Tay, B.K., Lau, S.P., Shi, X. and Ding, X.-z., Surface and Coatings Technology, 132, p. 228232, (2000).
6. Qi, J., Lai, K., Bello, I., Lee, C., Lee, S., Luo, J. and Wen, S., Journal Vacuum Science Technology A (Vacuum, Surfaces, and Films), 19, 1, p. 130–5, (2001).
7. Strondl, C., van der Kolk, G., Hurkmans, T., Fleischer, W., Trinh, T., Carvalho, N. and de Hosson, J.T.M., Surface and Coatings Technology, 142–144, p. 707–13, (2001).
8. Feng, M., Qiu-long, C., Xun, C., Gang, L. and Hong-ta, M., Materials Transactions, 43, 6, p. 1398–402, (2002).
9. Anders, S., Callahan, D., Pharr, G., Tsui, T. and Singh Bhatia, C., Surface and Coatings Technology, 94–95, 1–3, p. 189–94, (1997).
10. Davis, C., Thin Solid Films, 226, p. 3034, (1993).
11. Sheeja, D., Tay, B.K., Leong, K. and Lee, C., Diamond and Related Materials, 11, p. 1643–47, (2002).
12. Ban, M. and Hasegawa, T., Surface and Coatings Technology, 162, 1, p. 15, (2002).
13. Allam, T., Friedman, T., Schultz, P. and Sebastiani, D., Physical Review B (Condensed Matter and Materials Physics), 67, 24, p. 245309–1–11, (2003).
14. Tay, B.K., Sheeja, D. and Yu, L., Diamond and Related Materials, 12, p. 185194, (2003).
15. McKenzie, D.R., Tarrant, R.N., Bilek, M.M.M., Ha, T., Zou, J., McBride, W.E., Cockayne, D.J.H., Fujisawa, N., Swain, M.V., James, N.L., Wood, D.G. and McCulloch, D., Diamond and Related Materials, 12, p. 178184, (2003).
16. Dumkum, C., Grant, D.M. and McColl, I.R., Diamond and Related Materials, 6, 5–7, p. 802–6, (1997).

Multilayer structure, stress reduction and annealing of carbon film.

  • Peter C.T. Ha (a1), D. R. McKenzie (a1), D. Doyle (a2), D. G. McCulloch (a3) and Richard Wuhrer (a4)...

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed