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Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment

Published online by Cambridge University Press:  17 March 2011

C.W. Chang
Affiliation:
Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4, Engineering Drive 3, Singapore 117576
C.L. Gan
Affiliation:
Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4, Engineering Drive 3, Singapore 117576 School of Materials Engineering, Nanyang Technological University, Nanyang Avenue, Singapore, 639798
C.V. Thompson
Affiliation:
Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4, Engineering Drive 3, Singapore 117576 Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
K.L. Pey
Affiliation:
Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4, Engineering Drive 3, Singapore 117576 School of Electrical & Electronics Engineering, Nanyang Technological University, Nanyang Avenue, Singapore, 639798
W.K. Choi
Affiliation:
Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4, Engineering Drive 3, Singapore 117576 Department of Electrical and Computer Engineering, National University of Singapore, 4, Engineering Drive 3, Singapore, 117576
N. Hwang
Affiliation:
Microsystems, Modules & Components Laboratory, Institute of Microelectronics Singapore, 11, Science Park Road, Singapore Science Park II, Singapore 117685
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Abstract

Three terminal ‘dotted-I’ interconnect structures, with vias at both ends and an additional via in the middle, were tested under a variety of test conditions. Failures (mortalities) were observed even when segments were tested under conditions that would not have led to failure in two-terminal structures. Mortalities were found in right segments with jL values as low as 1250 A/cm, which is lower when compared to the immortality condition (jL)cr of 3700 A/cm reported for similar via-terminated structures. Moreover, we found that the mortality of a dotted-I segment is dependent on the direction and magnitude of the current in the adjacent segment. These results suggest that there is not a definite value of the jL product that defines true immortality in individual segments that are part of an interconnect tree. More importantly, the critical jL value for a single segment of Cu interconnects may be reduced or increased by an adjacent segment. Therefore independently determined (jL)cr values cannot be directly applied to interconnects with branched segments, but rather the magnitude as well as the direction of the current flow in the adjoining segments must be taken into consideration in evaluating the immortality of interconnect segments in an interconnect network.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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