The development of high power devices based on silicon carbide requires a more complete understanding of the oxide formation process and interface characteristics. By using an integrated UHV system, samples were cleaned and oxides deposited in situ. The approach of the oxide formation process was to form the initial insulator, a few angstroms thick, and then deposit an oxide. Various deposition techniques are used in the oxide growth process; both thermal and plasma enhanced chemical vapor deposition were employed with two different precursors (oxygen and nitrous oxide), and the results were compared with thermal oxidation. The morphology of each of the deposited oxides was compared to the bare substrate and the thermal oxide wafers. This study focuses on the morphology of the different deposition processes using AFM. Examination of the morphology of the initial insulator growth process and the oxide deposition process gives insight into the physical characteristics of the silicon dioxide deposited on silicon carbide. The RMS values of the initial insulator formation and the control wafers are 0.93 and 0.95 nm respectively. Meanwhile, the RMS values for PECVD (200–400°C) and thermal CVD (400–600°C for oxygen-silane and 800–1000°C for nitrous oxide-silane) range from 1.43 to 1.93 nm.