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Modeling of the Blister Test to Express Adhesive Strength in Terms of Measurable Quantities

Published online by Cambridge University Press:  15 February 2011

Jim Sizemore ,
David A. Stevenson  and
John Stringer
Jim Sizemore
Affiliation:
Stanford University, Department of Materials Science, Stanford, California 94305
David A. Stevenson
Affiliation:
Stanford University, Department of Materials Science, Stanford, California 94305
John Stringer
Affiliation:
Electric Power Research Institute, 3412 Hillview Avenue, Palo Alto, California 94304
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Abstract

The adhesion of chemical vapor deposited (CVD) diamond thin films to substrates is a major limitation to using this new and exciting material. It is important to have a quantitative and absolute measurement of adhesive strength to understand and identify remedies. There are many methods to measure adhesion, but most rely on comparison to a standard instead of being an absolute measurement. The blister test is potentially able to measure adhesion both quantitatively and absolutely, but the existing analysis is not sufficient. This paper presents a fracture mechanics approach to analyze the blister test for a circular plate in order to obtain the appropriate quantitative information, i.e., the crack extension force, G. Several shape models exist. We consider several models to predict the behavior of this plate and then derive an equation that expresses G in terms of the critical pressure and critical volume at which de-bonding occurs. As a result of this analysis, we identify the key experimental parameters and show that this equation is insensitive to the model used.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 165
Copyright
Copyright © Materials Research Society 1993

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References

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