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Mixed Mode Fracture in Electronic Packages
Published online by Cambridge University Press: 10 February 2011
Abstract
In this paper, mixedmode (mode I + mode II) fracture toughness data are presented for the prediction of molding compound (silica filled epoxy resin) failure. The stresses necessary to cause the package cracking under mixed mode loading are experimentally determined. Measured toughness values are presented as a function of modemixity and temperature
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- Research Article
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- Copyright © Materials Research Society 1997
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