Hostname: page-component-8448b6f56d-42gr6 Total loading time: 0 Render date: 2024-04-16T01:04:32.605Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructures and Mechanical Properties of Nanostructured Copper-304 Stainless Steel Multilayers Synthesized by Magnetron Sputtering

Published online by Cambridge University Press:  11 February 2011

X. Zhang ,
A. Misra ,
H. Wang ,
H. Kung ,
J. D. Embury ,
R. G. Hoagland  and
M. Nastasi
X. Zhang
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
A. Misra
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
H. Wang
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
H. Kung
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
J. D. Embury
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
R. G. Hoagland
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
M. Nastasi
Affiliation:
Materials Science and Technology Division, Mail Stop G755, Los Alamos National Laboratory, Los Alamos, NM 87545
Get access

Abstract

Nanostructured Cu/304 stainless steel (SS) multilayers were prepared by magnetron sputtering at room temperature. 304SS has a face-centered cubic (fcc) structure in bulk. However, in the Cu/304SS multilayers, the SS layers exhibited fcc structure for layer thickness of less than or equal to 5 nm. For 304SS layer thickness larger than 5nm, bcc 304SS grains were observed to grow on top of the initial ≈ 5 nm of fcc SS. The maximum hardness of Cu/304SS multilayers was ≈ 5.5 GPa (factor of two enhancement compared to rule of mixtures hardness) achieved at a layer thickness of 5nm, with a decrease in hardness with decreasing layer thickness below 5 nm. The hardness of fcc/fcc Cu/304SS multilayers (layer thickness ≤ 5 nm) is compared with Cu/Ni, another fcc/fcc system, to gain insight on how the mismatch in physical properties such as lattice parameters and shear moduli of the constituent layers affect the peak hardness achieved in these nanoscale systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 740: Symposium I – Nanomaterials for Structural Applications , 2002 , I2.8
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Clemens, B. M., Kung, H., Barnett, S. A., MRS Bulletin, 24, 20 (1999).Google Scholar
2. Anderson, P. M., Foecke, T., Hazzledine, P. M., MRS Bulletin, 24 (1999) 27.Google Scholar
3. Was, G. S., Foecke, T., Thin Solid Films, 286, 1 (1996).Google Scholar
4. Embury, J. D. and Hirth, J. P., Acta Metall. Mater., 42, 2051 (1994).Google Scholar
5. Hall, E. O., Pro. Roy. Soc. (London). B64, 474 (1951).Google Scholar
6. Petch, N. J., J. Iron Steel Inst., 174, 25 (1953).Google Scholar
7. Nix, W. D., Mater. Sci. Engg., A234–236, 37 (1997).Google Scholar
8. Koehler, J. S., Phys. Rev. B., 2, 547 (1970).Google Scholar
9. Shinn, M., Hultman, L., Barnett, S. A., J. Mater. Res., 7, 901 (1992).Google Scholar
10. Rao, S. I., Hazzledine, P. M., Phil. Mag. A, 80, 2011 (2000).Google Scholar
11. Misra, A. and Kung, H., Adv. Eng. Mater., 3, 217 (2001).Google Scholar
12. Hazzledine, P. M. and Rao, S. I., MRS Symp. Proc. 434, 135 (1996).Google Scholar
13. Tench, D. M., White, J. T., J. Electrochem. Soc., 138, 3757 (1991).Google Scholar
14. Parvin, K. and Weathersby, S. P., Barbee, T. W. Jr, Weihs, T. P. and Wall, M. A., Mater. Res. Soc. Symp. Proc., 382, 191 (1995).Google Scholar
15. Banas, Jacek, Mazurkiewicz, Andrzej, Mater. Sci. Engg., A, 277, 183 (2000).Google Scholar
16. Barbee, T. W., Jacobson, B. E., and Keith, D. L., Thin Solid Films, 63, 143 (1979).Google Scholar
17. Chu, X. and Barnett, S. A., J. Appl. Phys., 77, 4403 (1995).Google Scholar
18. Hoagland, R. G., Mitchell, T. E., Hirth, J. P. and Kung, H., Phil. Mag. A, 82, 643 (2002).Google Scholar