Hostname: page-component-848d4c4894-hfldf Total loading time: 0 Render date: 2024-05-09T06:05:40.092Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructural Development in Ion Beam Assisted Evaporation of Ni, Co and Fe Films

Published online by Cambridge University Press:  25 February 2011

J.A. Trogolo ,
R.A. Roy ,
R. Petkie ,
J.J. Cuomo  and
K. Rajan
J.A. Trogolo
Affiliation:
Materials Department, Rensselaer Polytechnic Institute, Troy NY
R.A. Roy
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
R. Petkie
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
J.J. Cuomo
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
K. Rajan
Affiliation:
Materials Department, Rensselaer Polytechnic Institute, Troy NY
Get access

Abstract

The development of microstructure in metal films deposited by ion-assisted evaporation has been studied by transmission electron microscopy (TEM). Films of Ni, Co, and Fe of about 350 to 500 nm thickness were deposited by electron beam evaporation with concurrent argon ion bombardment during growth. Films grown at high ion/atom ratios develop compressive stress as revealed by lattice dilatation. The trends in grain size, orientation, and shape as a function of ion bombardment are documented by TEM.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 202: Symposium C – Evolution of Thin Film and Surface Microstructure , 1990 , 187
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Roy, R.A., Petkie, R., Cuomo, J.J., and Karasinski, J., Surface and Coatings Technology (in press)Google Scholar
2. Harper, J.M.E., Cuomo, J.J., Gambino, R.J., and Kaufman, H.R., Ion Bombardment Modification of Surfaces: Fundamentals and Applications, Auciello, O. and Kelly, R., eds., Elsevier Science Pub. B. V., AmsterdamGoogle Scholar
3. Cuomo, J.J., Harper, J.M.E., Guarnieri, C.R., Yee, D.S., Attanasio, L.J., Wu, C.T., and Hammond, R.H., J. vac. Sci. Technol., 20 (1982) 349 Google Scholar
4. Yee, D.S., Floro, J., Mikalsen, D.J., Cuomo, J.J., Ann, K.Y., and Smith, D.A., J. Vac. Sci. Technol., A 3 (1985) 2121 Google Scholar
5. Rajan, K., Ramanathan, K.V., Roy, R.A., Petkie, R., and Cuomo, J.J., (to be published)Google Scholar
6. Rajan, K., Roy, R.A., Petkie, R., and Ramanathan, K.V., Mat. Res. Soc. Symp. Proc., 157, Beam-Solid Ineractions: Physical Phenomenon, Knopp, J.A., Borgenson, P., and Zuhr, R.A., eds. (1990)Google Scholar