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A Microscopical and Statistical Study of Electromigration Damage and Failure in Al-4wt.%Cu Tracks
Published online by Cambridge University Press: 15 February 2011
Abstract
We report a statistical analysis of electromigration (EM) induced damage and failure in unpassivated 1.4 mm long Al-4wt%Cu interconnects. The populations of damage sites of various types observed microscopically in life-tested samples are correlated with track width (1.1, 1.5 and 2.1 μm), temperature (200, 230, 260 and 300°C), current density (1, 2 and 3 × 1010 A m−2) and lifetest data. Some implications for damage and failure mechanisms are discussed.
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- Copyright © Materials Research Society 1992
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