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Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

  • Douglas Gauthier (a1), Andrew Mueller (a2), Robert David White (a3), Vincent Manno (a4), Chris Rogers (a5), Donald Hooper (a6), Sriram Anjur (a7) and Mansour Moinpour (a8)...


Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.



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1. Evans, C., Paul, E., Dornfeld, D., Lucca, D., Byrne, G., Tricard, M., Klocke, F., Dambon, O., and Mullany, B., CIRP Annals- Manufacturing Technology, vol. 52, no. 2, pp. 611633, 2003.
2. Paul, E., Journal of The Electrochemical Society, vol. 148, p. G359, 2001.
3. Cook, L., Journal of Non-Crystalline Solids, vol. 120, no. 1, pp. 152171, 1990.
4. Sorooshian, J., Hetherington, D., and Philipossian, A., Electrochemical and Solid-State Letters, vol. 7, p. G222, 2004.
5. Levert, J., Mess, F., Salant, R., Danyluk, S., and Baker, A., Tribology Transactions, vol. 41, no. 4, pp. 593599, 1998.
6. Lu, J., Rogers, C., Manno, V., Philipossian, A., Anjur, S., and Moinpour, M., Journal of The Electrochemical Society, vol. 151, p. G241, 2004.
7. Basim, G., Vakarelski, I., and Moudgil, B., Journal of Colloid And Interface Science, vol. 263, no. 2, pp. 506515, 2003.
8. , Feiler, Larson, I., Jenkins, P., and Attard, P., Langmuir, vol. 16, no. 26, pp. 10 269–10 277, 2000.
9. Roure, O. du, Saez, A., Buguin, A., Austin, R., Chavrier, P., Silberzan, P., and Ladoux, B., Proceedings of the National Academy of Sciences, vol. 102, no. 7, p. 2390, 2005.
10. Armani, D., Liu, C., and Aluru, N., Micro Electro Mechanical Systems, 1999. MEMS'99. Twelfth IEEE International Conference on, pp. 222227, 1999.
11. Sia, S. and Whitesides, G., Electrophoresis, vol. 24, no. 21, pp. 35633576, 2003.
12. Hopcroft, M., Kramer, T., Kim, G., Takashima, K., Higo, Y., Moore, D., and Brugger, J., Proc. JSME Adv. Technol. Exp. Mech, pp. 735742, 2003.



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