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Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

  • Douglas Gauthier (a1), Andrew Mueller (a2), Robert David White (a3), Vincent Manno (a4), Chris Rogers (a5), Donald Hooper (a6), Sriram Anjur (a7) and Mansour Moinpour (a8)...

Abstract

Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.

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