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Methods to Measure Mechanical Properties of NEMS and MEMS: Challenges and Pitfalls

Published online by Cambridge University Press:  31 January 2011

Ingrid De Wolf ,
Stanislaw Kalicinski ,
Jeroen De Coster  and
Herman Oprins
Ingrid De Wolf
Affiliation:
dewolfi@imec.be, IMEC, Leuven, Belgium
Stanislaw Kalicinski
Affiliation:
stanislaw.kalicinski@imec.be, IMEC, Leuven, Belgium
Jeroen De Coster
Affiliation:
jeroen.decoster@imec.be, IMEC, Leuven, Belgium
Herman Oprins
Affiliation:
herman.oprins@imec.be, IMEC, Leuven, Belgium
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Abstract

This paper focuses on the measurement of material properties of micro and nano-electromechanical systems. Two different methods are discussed: electrical or optical measurements of the resonance frequency, and measurements of the Raman frequency shift. The main focus of this paper is on challenges and pitfalls related to the use of these techniques for the study of MEMS and NEMS.

Keywords

microelectro-mechanical (MEMS)Raman spectroscopyoptical
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1185: Symposium II – Probing Mechanics at Nanoscale Dimensions , 2009 , 1185-II04-06
Copyright
Copyright © Materials Research Society 2009

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References

1. Connally, J.A. and Brown, S.B., “Slow crack growth in single-crystal silicon,” Science 256 (5063), 1537–1539 (1992).10.1126/science.256.5063.1537Google Scholar
2. Kazinczi, R., “Reliability of micromechanical thin-film resonators,” PhD thesis, ‘Technische Universiteit Delft’, (Elburon Publishers) (2002).Google Scholar
3. Kazinczi, R., Mollinger, J.R. and Bossche, A., “Environmental induced failure modes of thin film resonators,” Proc. SPIE, Smart materials and MEMS, 4234, 258–268 (2000).10.1117/12.424415Google Scholar
4. Kazinczi, R., Mollinger, J.R. and Bossche, A., “Adsorption-Induced Failure Modes of Thin-Film Resonators,” Proc. MSR Fall Meeting, symposium L, L8.8 (2001).10.1557/PROC-695-L8.8.1Google Scholar
5. Umeda, N., Ishizaki, S., and Uwai, H., “Scanning attractive force microscope using phoyothermal vibration,” J. Vac. Sci. Technol. B9, 1318–1322 (1991).10.1116/1.585187Google Scholar
6. Henry, J.A., Wang, Y. and Hines, M.A., “Controlling energy dissipation and stability of micromechanical silicon resonators with self-assembled monolayers”, Applied Physics Letters 84(10), 1765–1767 (2004).10.1063/1.1664015Google Scholar
7. Kalicinski, S., Tilmans, H.A.C., Wolf, I. de, “A new impedance measurement based method to determine the mechanical resonance frequency and charging in electrostatically actuated MEMS,” In: 18th Workshop on Micromachining, Micromechanics and Microsystems, 16-18 September 2007; Guimaraes, Portugal, 329–332 (2007 Google Scholar
8. Haspeslagh, L., Coster, J. De, Pedreira, O. Varela, Wolf, I. De, DuBois, B., Verbist, A., Hoof, R. Van, Willegems, M., Locorotondo, S., Bryce, G., Vaes, J., Drieenhuizen, B. van and Witvrouw, A., “Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications,” In proc.: Technical Digest International Electron Devices Meeting - IEDM, 655–658 (2008)10.1109/IEDM.2008.4796779Google Scholar
9. Wolf, I. De, Coster, J. De, Pedreira, O. Valera, Haspeslagh, L., Witvrouw, A., “Wafer level characterization and failure analysis of microsensors,” In: 7th IEEE Conference on Sensors, 144–147 (2008)10.1109/ICSENS.2008.4716404Google Scholar
10. Rembe, C., Boedecker, S., Draebenstedt, A., Pudewills, F. and Siegmund, G.,Heterodyne Laser-Doppler Vibrometer with a Slow-Shear-Mode Bragg Cell for Vibration Measurements up to 1.2 GHz,” In proc. SPIE 7098, 70980A–70980A (2008).10.1117/12.802930Google Scholar
11. Stoffels, S., Boedecker, S., Puers, R., Wolf, I. De, Tilmans, H.A.C. and Rembe, C., “Measuring the mechanical resonance frequency and quality factor of MEMS resonators with well-defined uncertainties using optical interferometric techniques,” Accepted for Transducers (2009).10.1109/SENSOR.2009.5285383Google Scholar
12. Knuuttila, J. V., Tikka, P.T., and Salomaa, M.M., “Scanning Michelson interferometer for imaging surface acoustic wave fields”, Optics Letters, 25, 613–615 (2000).10.1364/OL.25.000613Google Scholar
13. Wolf, I. De, “Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits,” Semicond. Sci. Technol,. 11, 139–154 (1996).10.1088/0268-1242/11/2/001Google Scholar
14. Wolf, I. De, “Semiconductors,” Analytical applications of Raman spectroscopy, ed. Pelletier, M. (Blackwell Publishing, 1999), Chapter 10Google Scholar
15. Wolf, I. De, Howard, D.J., Rasras, M., Lauwers, A., Maex, K., Groeseneken, G. and Maes, H.E., “A reliability study of titanium silicide Lines using micro-Raman spectroscopy and emission microscopy,” Microelectron. Reliab., 37 (10/11), 1591–1594 (1997).10.1016/S0026-2714(97)00117-0Google Scholar
16. Srikar, VT, Swan, AK, Ünlü, MS, Goldberg, BB and Spearing, SM, “Micro-Raman measurement of bending stresses in micromachined silicon flexures,: IEEE J. Microelectromech. Systems, 12 (6), 779–787 (2003).10.1109/JMEMS.2003.820280Google Scholar
17. Starman, LA Jr , Ochoa, EM, Lott, JA, Amer, MS, Cowan, WD and Bushbee, JD, “Residual stress characterization in MEMS microbridges using micro-Raman spectroscopy,” Modeling and Simulation of Microsystems, ISBN 0-9708275-7-1, 314–317 (2002).Google Scholar
18. Hedley, John, Hu, Zhongxu, Arce-Garcia, Isabel, and Gallacher, Barry J., “Mode Shape and Failure Analysis of High Frequency MEMS/NEMS using Raman Spectroscopy,” Proceedings of the 3rd IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems January 6-9, Sanya, China (2008).Google Scholar
19.EPSRC grant EP/C015045/1 (DyMARS) http://gow.epsrc.ac.uk/ViewGrant.aspx?GrantRef=EP/C015045/1Google Scholar
20. Spengen, M van. Reliability of MEMS. PhD dissertation, ISBN 90-5682-504-6, Katholieke Universiteit Leuven (2004).Google Scholar
21. Wolf, I. De, “Spectroscopic techniques for MEMS inspection”, Optical Inspection of Microsystems, ed. Osten, W. (Taylor&Francis, 2006), pp. 459–481 10.1201/9781420019162.ch14Google Scholar
22. Lee, S., Song, S., Au, V., and Moran, K.P., “Constriction/Spreading Resistance Model for Electronic Packaging,” Proceedings of the 4th ASME/JSME Thermal Engineering Joint Conference, 4, 199–206 (1995).Google Scholar