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Metal-Parylene Interconnection Systems

Published online by Cambridge University Press:  15 February 2011

S. Dabral ,
X. Zhang ,
B. Wang ,
G.-R. Yang ,
T.-M Lu  and
J.F. McDonald
S. Dabral
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
X. Zhang
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
B. Wang
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
G.-R. Yang
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
T.-M Lu
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
J.F. McDonald
Affiliation:
Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180. (Now at Intel Corp.; Now at Applied Materials)
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Abstract

This paper reports the results of a study to integrate a metal-parylene interconnection system. The advantages and issues are highlighted. Fabrication steps for packaging geometries as well as proposed fabrication steps for VLSI applications are discussed. The relevant material properties for interconnection system design have been compiled.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 205
Copyright
Copyright © Materials Research Society 1995

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References

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