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Metal-Ceramic Interfacial Reactions: The Copper-Cordierite and Titanium-Cordierite Systems.

Published online by Cambridge University Press:  21 February 2011

M. Bortz  and
F. S. Ohuchi
M. Bortz
Affiliation:
Central Research and Development Department, E. I. du Pont de Nemours and Company, Experimental Station, Building 356, Wilmington, Delaware 19898
F. S. Ohuchi
Affiliation:
Central Research and Development Department, E. I. du Pont de Nemours and Company, Experimental Station, Building 356, Wilmington, Delaware 19898
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Abstract

Interfacial reactions between either copper or titanium and cordierite-based (2MgO.2Al2O3.5SiO2) ceramic substrates are probed using X-ray Photoelectron Spectroscopy (XPS). Room temperature reactions are found to be strongly dependent on interfacial chemistry; while copper reacts weakly with the cordierite surface, titanium strongly reduces the Si-O and Al-O substrate bonds. Behavior during subsequent “in situ” annealing is dependent on substrate morphology. On amorphous cordierite films copper remains nonreactive while titanium dissociates remaining Si-O and Al-O bonds, forming a low valency Ti1+ oxide. On crystalline cordierite substrates copper diffuses rapidly upon annealing while titanium reduces substrate bonds forming a high valency Ti3+ oxide. Furthermore, thin 5Å Ti interlayers prevent copper diffusion at temperatures below 650°C. This study represents the first comprehensive treatment of the interfacial reactions in metal-multicomponent ceramic systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 119: Symposium F – Adhesions in Solids , 1988 , 167
Copyright
Copyright © Materials Research Society 1988

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References

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