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Mechanical Stress Measurements in Damascene-Fabricated Aluminum Interconnect Lines

  • Paul R. Besser (a1)

Abstract

The mechanical stress state of damascene-fabricated Al interconnect lines was determined on an array of lines on the product die of a logic technology device. Narrow, unpassivated, damascene Al lines have a purely hydrostatic stress (108 MPa). The hydrostatic stress of damascene Al lines (411 MPa) is much larger once the dielectric is deposited. However, the maximum shear stress remains small in magnitude, compared to RIE Al lines of similar thermal history and aspect ratio. The stress of damascene lines was measured as a function of linewidth. Unpassivated, wide lines, have compressive stresses along the length and width and zero along the line height. Passivated wide lines have a biaxial, tensile stress in-plane and zero along the line height.

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Mechanical Stress Measurements in Damascene-Fabricated Aluminum Interconnect Lines

  • Paul R. Besser (a1)

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