Skip to main content Accessibility help

Mechanical Properties of 0.1 Micron Thick Simox Film Measured Using on-Chip Tensile Test System

  • J. Amano (a1), T. Ando (a1), M. Shikida (a1), K. Sato (a1) and T. Tsuchiya (a2)...


We evaluated the mechanical properties of a very thin single-crystal-silicon film 140 nm thick fabricated from a SIMOX wafer using an on-chip tensile testing method. The silicon specimen oriented in the <110> direction was integrated with a loading mechanism on the same chip, which was fabricated in three etching steps. The strain in the film was measured using a newly developed tensile testing system having a two-field-of-view microscope that allowed us to observe the elongation of the specimen directly. The measured fracture strain was distributed in the range of 2.4-3.2%, which is narrower than the range of 1.3-3.5% for a thicker 5-νm film.



Hide All
1. Tsuchiya, T., Tabata, O., Sakata, J., and Taga, Y., J. MEMS. 7–1, 106 (1998).
2. Sharpe, W. N. Jr., Jackson, K. M., Hemker, K. J., and Xie, Z., J. MEMS. 10–3, 317 (2001).
3. Yi, T., Li, L., and Kim, C.-J., Sensors and Actuators, A83, 172 (2000).
4. Namazu, T., Isono, Y., and Tanaka, T., Proc. IEEE MEMS, 205 (2000).
5. Sato, K., Yoshioka, T., Ando, T., Shikida, M., and Kawabata, T., Sensors and Actuators, A70, 148 (1998).
6. Ishimaru, M., Tsunemori, T., Harada, S., Arita, M., and Motooka, T., Nucl. instrum. methods phys. res., B148, 311 (1999).


Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed