Skip to main content Accessibility help

Measurement of shape and deformation of MEMS at the wafer level

  • Cosme Furlong (a1), Curtis F. Ferguson (a1), Michael J. Melson (a1) and Ryszard J. Pryputniewicz (a1)


One of the approaches to fabrication of MEMS involves surface micromachining to define dies on single crystal silicon wafers, dicing of the wafers to separate the dies, and electronic packaging of the individual dies. Dicing and packaging of MEMS accounts for a large fraction of the fabrication costs, therefore, nondestructive evaluation at the wafer level, before dicing, can have significant implications on improving production yield and costs. In this paper, advances in development of optoelectronic holography (OEH) techniques for nondestructive, noninvasive, full-field of view evaluation of MEMS at the wafer level are described. With OEH techniques, quantitative measurements of shape and deformation of MEMS, as related to their performance and integrity, are obtained with sub-micrometer spatial resolution and nanometer measuring accuracy. To inspect an entire wafer with OEH techniques, measurements of overlapping regions of interest (ROI) on a wafer are recorded and adjacent ROIs are stitched together through efficient 3D correlation analysis algorithms.



Hide All
1. Gabriel, K. J., “Engineering microscopic machines,” Scientific American, 273 pp. 118121, 1995.
2. Hsu, T-R., MEMS & microsystems: design and manufacture, McGraw-Hill, New York, 2002.
3. Pryputniewicz, R. J., Marinis, T. F., Hanson, D. S., and Furlong, C., “New approach to development of packaging for MEMS inertial sensors,” Paper No. IMECE 2001/MEMS-23906, Am. Soc. of Mech. Eng., New York, 2001.
4. Furlong, C. and Pryputniewicz, R. J., Proc. Internat. Symp. on MEMS: Mechanics and Materials, Portland, OR, pp. 2833, 2001.
5. Furlong, C. and Pryputniewicz, R. J., Opt. Eng., 42(2), pp. 12231231, 2003.
6. Hunter, R. and Humphreys, C., Semicon. Int., 26(6), pp. 6064, 2003.
7. Brown, G. C. and Pryputniewicz, R. J., Opt. Eng., 37:13981405, 1998.
8. Pryputniewicz, R. J., de Boer, M. P., and Brown, G. C., Proc. IX Internat. Congress on Exp. Mech., Orlando, FL, pp. 10091012, 2000.
9. Pryputniewicz, R. J., Furlong, C., Brown, G. C., Pryputniewicz, E. J., and Seta, M. E., Proc. Internat. Congress on Experimental and Applied Mechanics for Emerging Technologies, Portland, OR, pp. 817820, 2001.
10. Pryputniewicz, E. J., Angelosanto, J. P., Brown, G. C., Furlong, C., and Pryputniewicz, R. J., Paper No. IMECE2001/EPP-24722, Am. Soc. Mech. Eng., New York, 2001.
11. Starck, J.-L., Murtagh, F., and Bijaoui, A., Image processing and data analysis: the multiscale approach, Cambridge University Press, New York, 1998.
12. Gonzalez, R. C. and Woods, R. E., Digital image processing, Prentice-Hall, Upper Saddle River, New Jersey, 2002.


Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed