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Materials Interactions in the Firing of Copper Thick Film Multilayer Ceramics

Published online by Cambridge University Press:  21 February 2011

William Borland  and
Vincent P. Siuta
William Borland
Affiliation:
E. I. Du Pont De Nemours &; Co., Inc., Electronics Department, Wilmington, De 19898
Vincent P. Siuta
Affiliation:
E. I. Du Pont De Nemours &; Co., Inc., Electronics Department, Wilmington, De 19898
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Abstract

In recent years, copper thick film materials have gained rapid acceptance in ceramic multilayer interconnect boards because of their ability to meet advanced packaging requirements at reasonable cost. With high volume production, however, problems such as opens, shorts, blisters and porosity have been experienced. Many of these failures may be attributed to undesirable materials interactions caused by reducing conditions which can be caused by incomplete burnout of thick film organics during firing.

This paper considers the interactions in current copper thick film material systems. Primary emphasis will be placed on chemical interactions that occur in both ideal and non-ideal conditions during firing. Failure modes will be related to chemistry and processing. New systems designed to overcome processing sensitivity will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 287
Copyright
Copyright © Materials Research Society 1988

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References

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