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Material Properties and Process Compatibility of Spin-on Nano-foamed Polybenzoxazole for Copper Damascene Process

  • Takashi Enoki (a1), Kenzo Maejima (a1), Hidenori Saito (a1) and Akifumi Katsumura (a1)

Abstract

We have developed nano-foamed OxD which has good properties such as dielectric constant=2.2, homogeneous distributed nano pores, smooth surface based on polybenzoxazole chemistry and nano-foaming technology. The nano-foamed OxD also has excellent thermal stability, chemical stability and etching property. The developed nano-foamed OxD is one of good candidates for copper damascene structure to achieve shrinking dimensions of future semi-conductor devices.

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