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Low Stress Silicon Nitride and Polysilicon Films for Micromachining Applications
Published online by Cambridge University Press: 21 February 2011
Abstract
Reduced stress silicon nitride and undoped, as deposited, polysilicon films have been characterized on a variety of silicon based substrates within the confines of co-fabrication compatibility of micromechanical structures with VLSI processing. Average stress and stress uniformity through the films are shown to vary with substrate parameters.
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- Copyright © Materials Research Society 1990
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