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Low Profile Packaging for MEMS Aero-acoustic Sensors

  • John R. Burns (a1), Robert D. White (a1) and Joshua S. Krause (a1)


This paper describes a semi-automated conductive ink process used for packaging MEMS devices. The method is applied to packaging of MEMS sensors for wind tunnel testing. The primary advantage of the method is a reduction in surface topology between the package and the integrated MEMS sensors. In this paper we explore the relationship between trace dimensions, resistivity, and deposition parameters such as feed rate, tip-substrate separation and tip diameter. Using this procedure it is possible to generate interconnects between a PC board and MEMS sensor chip with a topology of less than 25 micrometers.



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[1] Frear, D. R., Werner, R.G, Sorongon, E., Electronic Materials Conference, Materials Issues in Area-Array Microelectronic Packaging, (Electronic Materials Committee of The Minerals, Metals & Materials Society, Warrendale, PA) pp. 2227
[2] Harman, G. G., Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, 2nd Ed. (Mcgraw-Hill, U.S., 1997) pp. 14.
[3] Krause, J. S., Ph. D Dissertation, Micromachined Microphone Array on a Chip For Turbulent Boundary Layer Measurements. pg. Tufts University, 2011
[4] Krause, J. S., White, R. D., Moeller, M. J., Gallman, J. M., Holup, G., and DeJong, R. “MEMS Pressure Sensor Array for Aeroacoustic Analysis of the Turbulent Boundary Layer” in Proceedings of the 48th AIAA Aerospace Sciences Meeting, Orlando, Florida, January 47, 2010.
[5] Athikulwongse, K., Lim, S. K., Kim, D. H., A Study of Through-Silicon-Via Impact on the 3D Stacked IC Layout, School of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, Georgia.
[6] Monie, S. Ph.D, Industrial Specialty Printing. 2829 (2010)


Low Profile Packaging for MEMS Aero-acoustic Sensors

  • John R. Burns (a1), Robert D. White (a1) and Joshua S. Krause (a1)


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