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Load- and Depth-Sensing Indentation Tester for Properties Measurement at Non-Ambient Temperatures

Published online by Cambridge University Press:  15 February 2011

Karl B. Yoder  and
Donald S. Stone
Karl B. Yoder
Affiliation:
Materials Science Program, University of Wisconsin-Madison, 1500 Johnson Dr., Madison, WI 53706
Donald S. Stone
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin-Madison, 1509 University Avenue, Madison, WI 53706
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Abstract

The ability to measure the temperature-dependence of the hardness of thin films is useful from both an applications and a scientific standpoint. For this reason, we have designed and constructed a load- and depth-sensing indentation tester combining sub-nanometer resolution with the ability to operate over a range of temperatures, currently 150K to 400K. This paper describes the new experimental apparatus and reports preliminary data on 440C stainless steel substrates with and without a 0.75 μm ZrN coating.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 121
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1 Pethica, J. B., Hutchings, R., and Oliver, W. C., Phil. Mag A. , 48, 593 (1983).CrossRefGoogle Scholar
2 Doerner, M. F. and Nix, W. D., J. Mater. Res., 1, 601 (1986).CrossRefGoogle Scholar
3 Nannula, S.-P., Stone, D. S., and Li, C.-Y. in Electronic Packaging Materials Science, edited by Giess, A.E., Tu, K. N., and Kidson, J. (Mater. Res. Soc. Proc. 40, Pittsburg, PA, 1985) pp. 217–224.Google Scholar
4 Weppelmann, E. R., Field, J. S., and Swain, M. V., J. Mater. Res., 8, 830 (1993).CrossRefGoogle Scholar
5 Wu, T. W., J. Mater. Res., 6, 407 (1991).CrossRefGoogle Scholar
6 Yoder, K. B., Stone, D. S., Sproul, W. D., and Rudnik, P. J. in AdvancedEarth-to-Orbit Propulsion Technology 1992 edited by Richmond, R. J. and Wu, S. T. (NASA Conf. Publ. 3174, Vol II) pp. 317–324.Google Scholar
7 Stone, D. S., Yoder, K.B., and Sproul, W.D., J. Vac. Soc. Technol. A 9, 2543 (1991)CrossRefGoogle Scholar
8 Stone, D. S., J. Electronic Packaging, 112, 41 (1990).CrossRefGoogle Scholar
9 Yoder, K.B. and Stone, D.S., to be submitted.Google Scholar