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Laser-Chemical 3-D Micromachining

  • T. M. Bloomstein (a1) and D. J. Ehrlich (a1)


Three-dimensional parts are machined in silicon using laser-induced chlorine etching reactions. Structures are created directly from solid-modeling computer-aided-design/computer-aided-manufacturing software. Removal rates exceeding 2×104 and 105μm3/s, several orders of magnitude faster than electrodischarge machining methods, are achieved at 1-μm, and 15-μm x-y resolution, respectively. Laser-induced metallization of resulting structures as well as replication through compression molding have been demonstrated.



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1. See, for example, Laser Microfabrication: Thin Film Processes and Lithography, edited by Ehrlich, D. J. and Tsao, J. Y. (Academic, Boston, 1989).
2. Bloomstein, T. M. and Ehrlich, D. J., in Proceedings of MEMS “91 (IEEE, New York, 1991), pp. 202203;
Bloomstein, T. M. and Ehrlich, D. J., Appl. Phys. Lett. 61, 708 (1992).
3. Ehrfeld, W., Götze, F., Münchmeyer, D., Schelb, W., and Schmidt, D., in Technical Digest of the Solid-State Sensor and Acutator Workshop (IEEE, New York, 1988), pp. 14;
Guckel, H., Christenson, T.R., Skrobis, K.J., Denton, D.D., Choi, B., Lovell, E.G., Lee, J. W., Bajikar, S.S., and Chapman, T. W., in Technical Digest of the Solid-State Sensor and Actuator Workshop (IEEE, New York, 1990), pp. 118122.
4. see Ashby, C. I. H. and Tsao, J. Y., Ref. 1, pp. 268271.
5. See, for example, Muraski, S. J., Mach. Des. 62, 127 (1990).
6. see Ritsko, J., Ref. 1, pp. 333344.
7. Loney, G. C., Proc. SPIE 1454, 198 (1991).
8. see Zeiger, H. J., Ehrlich, D. J., and Tsao, J. Y., Ref. 1, pp. 285330. Note that a misprint exists in Fig. 5.4 of this reference; the horizontal axis should read: lOO× shorter times.
9. Ehrlich, D. J. and Tsao, J. Y., Appl. Phys. Lett. 44, 267 (1984).


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