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Laser Fabrication of Silicon on Dielectric Substrates

Published online by Cambridge University Press:  15 February 2011

H. J. Leamy*
Affiliation:
Bell Laboratories, Murray Hill, New Jersey 07974
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Abstract

The growth of device-worthy silicon crystals on insulating substrates would have a revolutionary impact upon microelectronics, and is consequently the object of intense effort. This article reviews recent progress in the application of laser and electron beams and incoherent light to this end. In every case, radiant energy is employed to melt a precursor material, from which device-worthy layers are produced during resolidification. Techniques include seeded and unseeded growth, partial and complete encapsulation of the liquid layer, and oscillation of the solid-liquid interface. Considerations of liquid zone stability, temperature gradient control, and interface morphological stability are central to each technique. Progress in this field has been rapid and several techniques have been successfully demonstrated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1982

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References

REFERENCES

[1] Laser and Electron Beam Processing of Materials editors: White, C. W. and Peercy, P. S. (Academic Press, New York 1980).Google Scholar
[2] Laser and Electron Beam-Solid Interactions and Materials Processing.: M. R. S. Symposia Proceedings, Vol. 1 editors, Gibbons, J. F., Hess, L. D. and Sigmon, T. W. (North­Holland, New York 1981).Google Scholar
[3] Gat, A., Gerzberg, L., Gibbons, J. F., Magee, T. J., Peng, J. and Hong, J. D., Appl. Phys. Lett. 33, 8 (1978).Google Scholar
[4] Kamins, T. I., Lee, K. F. and Gibbons, J. F., IEEE Elect. Dev. Lett. EDL–1, 5 (1980).10.1109/EDL.1980.25206Google Scholar
[5] Lee, K. F., Gibbons, J. F., Saraswat, K. C. and Kamins, T. I., Applied Physics Letters 35, 173 (1979).10.1063/1.91025Google Scholar
[6] Grain Boundaries in Semiconductors, M.R.S. Symposia Proceedings Series, Editors: Pike, G. E., Seager, C. H. and Leamy, H. J. (North­Holland, New York 1980).Google Scholar
[7] Lam, H. W., these proceedings.Google Scholar
[8] Bean, K. E. and Runyan, W. R., J. Electrochem. Soc. 124, 5C (1977).10.1149/1.2133246Google Scholar
[9] Biegelsen, D. K., Johnson, N. M., Bartelink, D. J. and Moyer, M. D. in ref. 2, pp. 487–494.Google Scholar
[10] Lemons, R. A., Bosch, M. A., Dayem, A. H., Grogan, J. K. and Mankiewich, P. M., Appl. Phys. Lett., in press.Google Scholar
[11] Maserjian, J., Solid State Elect. 6, 477 (1963).10.1016/0038-1101(63)90032-7Google Scholar
[12] Celler, G. K., Leamy, H. J. and Trimble, L. E., J. Elect. Mater. to appear.Google Scholar
[13] An excellent demonstration of this effect is given by Jackson, K. A. and Miller, C. E., J. Cryst. Growth, 42, 364 (1977).10.1016/0022-0248(77)90219-6Google Scholar
[14] Anthony, T. R. and Cline, H. E., J. Appl. Phys. 48, 3888 (1977).10.1063/1.324260Google Scholar
[15] Schott, J. T., Electrochem. Soc. Extended Abstracts, 80–2, 1081 (1980).Google Scholar
[16] Celler, G. K., Leamy, H. J., Trimble, L. E. and Sheng, T. T., Appl. Phys. Lett. 39, 425 (1981).10.1063/1.92760Google Scholar
[17] Gilmer, G. H. and Leamy, H. J.: in ref. 1, pp. 227–233.Google Scholar
[18] Leamy, H. J., Brown, W. L., Celler, G. K., Foti, G., Gilmer, G. H. and Fan, J. C. C.: in ref. 2, pp. 89–96.Google Scholar
[19] Auvert, G., Bensahel, D., Perio, A., Nguyen, V. T. and Rozgonyi, G. A., Appl. Phys. Lett. 39, 724 (1981).10.1063/1.92862Google Scholar
[20] Auvert, G. et al. these proceedings.Google Scholar
[21] Gibbons, J. F. has reviewed Stanford work in ref. 2, pp. 449–462.Google Scholar
[22] Ng, K. K., Celler, G. K., Povilonis, E. I., Frye, R. C., Leamy, H. J. and Sze, S. M., IEEE Elect. Device Lett. EDL2, 316 (1981).10.1109/EDL.1981.25448Google Scholar
[23] Leamy, H. J., Frye, R. C., Ng, K. K., Celler, G. K., Povilonis, E. I. and Sze, S. M., Appl. Phys. Lett., in press.Google Scholar
[24] Johnson, N. M., Biegelsen, D. K. and Moyer, M. D., Appl. Phys. Lett. 38, 900 (1981).10.1063/1.92221Google Scholar
[25] Frye, R. C. and Ng, K. K., in ref. 6.Google Scholar
[26] Fastow, R. M., Leamy, H. J., Celler, G. K., Wong, Y. H. and Doherty, C. J.: in ref. 2. pp. 495–502.Google Scholar
[27] Kamins, T. I. and Pianetta, P. A., IEEE Elect. Dev. Lett. EDL1, 214 (1980).10.1109/EDL.1980.25293Google Scholar
[28] Geis, M. W., Antoniadis, D. A., Silversmith, D. J., Mountain, R. W. and Smith, H. I., J. Vac. Sci. Technol. 18, 229 (1981).10.1116/1.570730Google Scholar
[29] Maby, E. W., Geis, M. W., LeCoz, Y. L., Silversmith, D. J., Mountain, R. W. and Antoniadis, D. A., IEEE Elect. Dev. Lett. EDL2, 24 (1981).Google Scholar
[30] Gibbons, J. F., Lee, K. F., Magee, T. J., Peng, J. and Ormond, R., Appl. Phys. Lett. 34, 831 (1979).10.1063/1.90699Google Scholar
[31] Geis, M. W., Flanders, D. C. and Smith, H. I., Appl. Phys. Lett. 35, 71 (1979).10.1063/1.90936Google Scholar
[32] Magee, T. J., Palkuti, L. J., Ormond, R., Leung, C. and Graham, S., Appl. Phys. Lett. 38, 248 (1981).10.1063/1.92332Google Scholar
[33] Tamura, M., Tamura, H. and Tokuyama, T., Japan J. Appl. Phys. 19, L23 (1980).10.1143/JJAP.19.L23CrossRefGoogle Scholar
[34] Kamins, T. I., Cass, T. R., Dell'Oca, C. J., Lee, K. F., Pease, R. F. W. and Gibbons, J. F., J. Electrochem. Soc. 128, 1151 (1981).10.1149/1.2127568Google Scholar
[35] Lam, H. W., Pinizzotto, R. F. and Tasch, A. F. Jr., J. Electrochem. Soc. 128, 1981 (1981).10.1149/1.2127779Google Scholar
[36] Trimble, L. E., Celler, G. K., Ng, K. K., Baumgart, H. and Leamy, H. J., these proceedings.Google Scholar
[37] Kuech, T. F. and McCaldin, J. O., Appl. Phys. Lett. 37, 44 (1980).10.1063/1.91697Google Scholar
[38] Lam, H. W., Tasch, A. F. Jr. and Holloway, T. C., IEEE Elect. Dev. Lett. EDL1, 206 (1981).10.1109/EDL.1980.25290Google Scholar
[39] Kamins, T. I. and Pianetta, P. A., IEEE Elect. Dev. Lett. EDL1, 214 (1980).10.1109/EDL.1980.25293Google Scholar
[40] Gibbons, J. F. and Lee, K. F., IEEE Elect. Dev. Lett. EDL1, 117 (1980).10.1109/EDL.1980.25252Google Scholar
[41] Baumgart, H., Leamy, H. J., Ng, K. K. and Doherty, C. J., unpublished research.Google Scholar
[42] Fan, J. C. C., Geis, M. W. and Tsaur, B.­Y., Appl. Phys. Lett. 38, 365 (1981).10.1063/1.92339CrossRefGoogle Scholar
[43] Tsaur, B.­Y., Fan, J. C. C., Geis, M. W., Silversmith, D. J. and Mountain, R. W., Appl. Phys. Lett. 39, 562 (1981).Google Scholar
[44] Geis, M. W., Smith, H. I., Tsaur, B.­Y., Fan, J. C. C., Maby, E. W. and Antoniadis, D. A., Appl. Phys. Lett. in press.Google Scholar
[45] Leamy, H. J., Lemons, R. A., Farrow, R. C., Baumgart, H., Cheng, J. and Chang, C. C., unpublished research.Google Scholar
[46] See e.g., Hurle, D. T. J. in Crystal Growth: an Introduction, Hartman, P., ed. (North Holland, New York 1973) pp. 210247.Google Scholar