Hostname: page-component-7bb8b95d7b-dvmhs Total loading time: 0 Render date: 2024-09-23T19:32:51.559Z Has data issue: false hasContentIssue false

Laser Densification Modeling

Published online by Cambridge University Press:  28 February 2011

Taipau Chia
Affiliation:
Advanced Materials Research Center, University of Florida, One Progress Blvd., #14, Alachua, FL 32615.
L. L. Hench
Affiliation:
Advanced Materials Research Center, University of Florida, One Progress Blvd., #14, Alachua, FL 32615.
Chaobin Qin
Affiliation:
Department of Mechanical Engineering, University of Florida, Gainesville, FL 32611.
C. K. Hsieh
Affiliation:
Department of Mechanical Engineering, University of Florida, Gainesville, FL 32611.
Get access

Abstract

A three-dimensional transient model for heat conduction in silica glass is developed. The model simulates a three-dimensional temperature distribution in a silica glass irradiated by a moving CO2 laser. Both the reflectivity of the glass surface and the strong attenuation of the laser energy in the glass medium are accounted for by a detailed radiation analysis. The energy absorbed by the glass is determined to be confined in a 10 μm thickness; the laser irradiation is thus treated as a boundary condition. The heat diffusion equation is solved by an alternating direction-implicit method.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Rappaz, M., Carrupt, B., Zimmermann, M. and Kurz, W., Helvetica Physica Acta 60, 924936 (1987).Google Scholar
2. Chang, C. Y., Fang, Y. K., Wu, B. S., and Chen, R. M., Mat. Res. Soc. Symp. Proc. 23, 497 (1984).Google Scholar
3. Calder, I. D. and Sue, R., J. Appl. Phys. 53 (11), 7545 (1982).Google Scholar
4. Hench, L. L., Wang, S. H., and Nogues, J. L., SPIE 878, 76 (1988).Google Scholar
5. Hench, L. L., in Science of Ceramic Chemical Processing, edited by Hench, L. L. and Ulrich, D. R. (Wiley-Interscience, 1986), pp. 5264.Google Scholar
6. Park, S. C. and Hench, L. L., in Science of Ceramic Chemical Processing, edited by Hench, L. L. and Ulrich, D. R. (Wiley-Interscience, 1986), pp. 168172.Google Scholar
7. Hsieh, C. K. and Su, K. C., The Journal of Solar Energy Science and Technology 22, 37 (1979).Google Scholar
8. Batteh, J. H., J. Appl. Phys. 53 (11), 7537 (1982).Google Scholar
9. Ozisik, M. N., in Heat Conduction, Wiley-Interscience, 1980, p. 6Google Scholar
10. Rosenthal, D., Trans. Am. Soc. Mech. Engrs. 68, 849 (1946)Google Scholar
11. Ozisik, M. N., in Heat Conduction, Wiley-Interscience, 1980, pp. 493–495Google Scholar
12. Touloukian, Y. S. and Buyco, E. H., in Thermophysical Properties of Matter, The TPRC Data Series, Vol. 2, 1970, p. 202.Google Scholar
13. Touloukian, Y. S., Powell, R. W., Ho, C. Y., and Kleme, P. G. Thermophysical Properties of Matter, The TPRC Data Series, Vol. 2, 1970, p. 922.Google Scholar