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Internal Stresses and Adhesion Properties of Film/Substrate Interfaces
Published online by Cambridge University Press: 16 February 2011
Abstract
The evolution of internal stresses in Tungsten films deposited on Silicon substrates submitted to external stresses is discussed here. The stresses are estimated and measured by theoretical and experimental methods. The discussion of the internal stress evolution is shown to be dependent of the film/substrate interfaces, and of the loss of adhesion inducing stress relaxation.
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- Copyright © Materials Research Society 1990
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