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Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding
Published online by Cambridge University Press: 10 February 2011
Abstract
A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.
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- Research Article
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- Copyright © Materials Research Society 1998
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