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Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints

  • Sheera Knecht (a1)

Abstract

The matrix creep failure indicator developed by Shine and Fox is extended to cases when strain is multiaxial and varies with position in the structure. Analysis of a thermal fatigue test of leaded surface mount devices found in the literature illustrates application of the method. A butt joint surface mount configuration is then tested in simple mechanical loading and also analyzed using the finite element method. It is found that the matrix creep “damage integral” method gives good correlation with observed solder fatigue failures for both cases.

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1. Knecht, S. and Fox, L.R., “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans. Comp., Hybrids, Manuf. Technol. vol. CHMT–13, pp. 424433, 1990.
2. Shine, M.C. and Fox, L.R., “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue - ASTM Special Technical Publication 942, 1987, pp. 588610.
3. Engelmaier, W. and Attarwala, A.I., “Surface-Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards,” IEEE Trans. Comp., Hybrids, Manuf. Technol. Vol. CHMT–12, pp. 284296, 1989.
4. Knott, J.F., Fundamentals of Fracture Mechanics, Wiley, 1973.
5. Iannuzzelli, R., “Validation of Module Assembly Physical Models,” 40th Electronic Components and Technology Conference, May 21-23, 1990.
6. ABAQUS v.4.8, Hibbitt, Carlsson, and Sorenson, 1989.

Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints

  • Sheera Knecht (a1)

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